by Zhu, Jun, Zhang, David Wei, Kuo, Chinte, Wang, Qing, Wei, Fang, Zhang, Chenming, Chen, Han, He, Daquan, Hsu, Stephen D.
Published in Journal of semiconductors (01.07.2017)

by Chen Sheng, Shi Yanping, Chen Qiang, Chinte Kuo
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)

by Zheng, Hui, Yin, Bin. F., Chen, Lei G., Zhou, Ke, Kuo, Chinte
Published in IEEE transactions on electron devices (01.04.2018)

by Kuo, Chinte, Wei, Wen, Cai, Martin, Chen, Leon, Wang, Yong, Zhang, David Wei
Published in Materials science in semiconductor processing (15.03.2017)

by Wang, Yang, Wang, Chen, Chen, Tao, Liu, Hao, Kuo, Chinte, Zhou, Ke, Yin, Binfeng, Chen, Lin, Sun, Qing-Qing
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)

by Kuo, Chinte, Wei Zhang, David, Wei, Wen, Chen, Frank, Pang, Albert
Published in Materials science in semiconductor processing (01.01.2016)

by Jun Zhu David Wei Zhang Chinte Kuo Qing Wang Fang Wei Chenming Zhang Han Chen Daquan He Stephen D.Hsu
Published in 半导体学报：英文版 (2017)

by Chen, Qiang, Kuo, Chinte
Year of Publication 24.05.2018

by Zheng, Hui, Yin, Binfeng, Chen, Leigang, Zhou, Ke, Kuo, Chinte
Published in 2018 China Semiconductor Technology International Conference (CSTIC) (01.03.2018)

by CHINTE KUO, GAO JINDE, XI YULING
Year of Publication 01.09.2017