Method for joining semiconductor components with a flexible support band comprises moving an endless band parallel to the running direction of the support band between heating elements and the components
KUNZE, WOLFRAM, POENITZ, VOLKER, KLOOS, MATTHIAS, BERGMANN, DIETER, BIERL, STEFAN
Year of Publication 08.06.2006
Get full text
Year of Publication 08.06.2006
Patent
Connecting device for electrical or electronic components comprises a temperature-variable and pressure-exerting thermode having on its pressing surface an electrically conducting temperature-variation element
KUNZE, WOLFRAM, TSCHENKER, FRANK, MONSER, HANS-PETER, BERGMANN, DIETER
Year of Publication 03.06.2004
Get full text
Year of Publication 03.06.2004
Patent