Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress
Chen, Po-Ying, Kung, Heng-Yu, Lai, Yi-Shao, Tsai, Ming Hsiung, Yeh, Wen-Kuan
Published in Japanese Journal of Applied Physics (01.02.2008)
Published in Japanese Journal of Applied Physics (01.02.2008)
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Journal Article
The effect of stressing history in reliability characteristics
Po-Ying Chen, Heng-Yu Kung, Yi-Shao Lai, Wen-Kuan Yeh
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
An experimental investigation of current stressing on wafer-level chip-scale packages
Yi-Shao Lai, Heng-Yu Kung, Po-Ying Chen, Wen-Kuan Yeh
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
Dynamic scanning method to clarify the mechanism of WLCSP package reliability issue
Po-Ying Chen, Chwei-Shyong Tsai, Ming-Hsiung Tsai, Heng-Yu Kung, Shen-Li Chen, Jing, M.H., Wen-Kuan Yeh
Published in 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (01.10.2008)
Published in 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (01.10.2008)
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Conference Proceeding