Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints
Coyle, R., Osenbach, J., Collins, M. N., McCormick, H., Read, P., Fleming, D., Popowich, R., Punch, J., Reid, M., Kummerl, S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2011)
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Journal Article
Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling
Rahangdale, Unique, Srinivas, Rahul, Krishnamurthy, S., Rajmane, Pavan, Misrak, Abel, Sakib, A. R., Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, Luu T.
Published in 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (2017)
Published in 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (2017)
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Conference Proceeding
OPEN CAVITY INTEGRATED CIRCUIT
CLEMENTE, Laura, KUMMERL, Steven, DELPAK, Sophia, KODURI, Sreenivasan
Year of Publication 06.06.2024
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Year of Publication 06.06.2024
Patent