INTEGRATED INDUCTOR WITH MAGNETIC MOLD COMPOUND
MULLENIX, Joyce Marie, MASSOLINI, Roberto Giampiero, HOU, Dongbin, KUMMERL, Steven Alfred
Year of Publication 02.07.2020
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Year of Publication 02.07.2020
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EXPOSED HEAT-GENERATING DEVICES
CHIEN, Yuh-Harng, YU, Fu-Hua, PAN, Bo-Hsun, KUMMERL, Steven Alfred, CHIEN, Chi-Chen, CHOU, Hung-Yu
Year of Publication 22.04.2021
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Year of Publication 22.04.2021
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ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD
Chien, Yuh-Harng, Kummerl, Steven Alfred, Yu, Frank, Ho, Chih-Chien, Chou, Stanley, Huang, Pi-Chiang, Pan, Bo-Hsun
Year of Publication 11.02.2021
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Year of Publication 11.02.2021
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MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
CHIEN, Yuh-Harng, LEE, Fu-Kang, KUMMERL, Steven Alfred, CHOU, Hung-Yu
Year of Publication 24.10.2019
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Year of Publication 24.10.2019
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MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS
CHIEN, Yuh-Harng, LEE, Fu-Kang, KUMMERL, Steven Alfred, CHOU, Hung-Yu
Year of Publication 04.07.2019
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Year of Publication 04.07.2019
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Mechanical couplings designed to resolve process constraints
Chien, Yuh-Harng, Lee, Fu-Kang, Chou, Hung-Yu, Kummerl, Steven Alfred
Year of Publication 02.07.2019
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Year of Publication 02.07.2019
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SEMICONDUCTOR DEVICES AND METHODS AND APPARATUS TO PRODUCE SUCH SEMICONDUCTOR DEVICES
Neidorff, Robert Allan, Male, Barry Jon, Smeys, Peter, Kummerl, Steven Alfred, Cook, Benjamin
Year of Publication 09.05.2019
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Year of Publication 09.05.2019
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THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD
Koduri, Sreenivasan K, Edwards, Henry L, Kummerl, Steven, Maggio, Kenneth J
Year of Publication 08.11.2018
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Year of Publication 08.11.2018
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PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
HERBSOMMER, Juan, Alejandro, ROMIG, Matthew, David, SHIH, Wei-Yan, COOK, Benjamin, Stassen, KUMMERL, Steven, Alfred
Year of Publication 09.05.2018
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Year of Publication 09.05.2018
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PACKAGES WITH MULTIPLE EXPOSED PADS
CHIEN, Yuh-Harng, CHEN, Jie, YU, Fu-Hua, MURUGAN, Rajen M, PAN, Bo-Hsun, KUMMERL, Steven Alfred, CHOU, Hung-Yu
Year of Publication 21.11.2019
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Year of Publication 21.11.2019
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