An in vitro evaluation of Icon resin infiltrant penetration into demineralized enamel lesions using an indirect staining technique with confocal laser scanning microscope analysis in dual fluorescence mode
Srikumar, G P V, Ghosh, Megha, Kumar, A Arvind, Bardia, Siddharth, Wasule, Akansha, Beautlin, J S
Published in Journal of conservative dentistry and endodontics (01.04.2024)
Published in Journal of conservative dentistry and endodontics (01.04.2024)
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Various applications of fibers in Endodontics
Devi M, Niranjana, Paulaian, Benin, Kumar A, Arvind, Sankar MS, Ravi, Joel, Jeffrey
Published in IP Indian Journal of Conservative and Endodontics (28.06.2022)
Published in IP Indian Journal of Conservative and Endodontics (28.06.2022)
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Room temperature ppb level Cl 2 sensing using sulphonated copper phthalocyanine films
Kumar, Arvind, Singh, A., Debnath, A.K., Samanta, S., Aswal, D.K., Gupta, S.K., Yakhmi, J.V.
Published in Talanta (Oxford) (15.09.2010)
Published in Talanta (Oxford) (15.09.2010)
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Journal Article
Comparative evaluation of apical extrusion of intracanal bacteria using four single-file NiTi instruments: An in vitro study
Sarthaj, A, Gopal, V, Kumar, A, Paulaian, Benin, Raveendran, Lal, DeviPrasad, C
Published in Endodontology : journal of Indian Endodontic Society (01.01.2019)
Published in Endodontology : journal of Indian Endodontic Society (01.01.2019)
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HIGH PERFORMANCE INTERCONNECT
Spink, Aaron T, Johnson, Simon P, Fahim, Bahaa, Nale, William Harry, Beers, Robert, Swanson, Jeffrey C, Geetha, Vedaraman, Spagna, Fulvio, Das, Abhishek, Kumar, Arvind A, Shah, Rahul R, Blankenship, Robert G, Das Sharma, Debendra, Gupta, Ashish, Jue, Darren S, Iyer, Sitaraman V, Safranek, Robert J, Willey, Jeff, Ramanujan, Raj K, Hum, Herbert H, Dhillon, Yuvraj S, Liu, Yen-Cheng, Iyer, Venkatraman, Maddox, Robert A
Year of Publication 11.01.2024
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Year of Publication 11.01.2024
Patent
NONLINEAR PI CONTROLLER FOR pH PROCESS
Kumar, A. ARVIND, CHIDAMBARAM, M., RAO, V. S. R., PICKHARDT, RAINER
Published in Chemical engineering communications (01.02.2004)
Published in Chemical engineering communications (01.02.2004)
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High performance interconnect
Spink, Aaron T, Johnson, Simon P, Fahim, Bahaa, Nale, William Harry, Beers, Robert, Swanson, Jeffrey C, Geetha, Vedaraman, Spagna, Fulvio, Das, Abhishek, Kumar, Arvind A, Shah, Rahul R, Blankenship, Robert G, Das Sharma, Debendra, Gupta, Ashish, Jue, Darren S, Iyer, Sitaraman V, Safranek, Robert J, Willey, Jeff, Ramanujan, Raj K, Hum, Herbert H, Dhillon, Yuvraj S, Liu, Yen-Cheng, Iyer, Venkatraman, Maddox, Robert A
Year of Publication 29.08.2023
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Year of Publication 29.08.2023
Patent
Electrical margining of multi-parameter high-speed interconnect links with multi-sample probing
Chhabbi Shreesh, Kumar Arvind A, Iyer Venkatraman, Rangarajan Thanunathan
Year of Publication 14.11.2017
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Year of Publication 14.11.2017
Patent
HIGH PERFORMANCE INTERCONNECT
Spink, Aaron T, Johnson, Simon P, Fahim, Bahaa, Nale, William Harry, Beers, Robert, Swanson, Jeffrey C, Geetha, Vedaraman, Spagna, Fulvio, Das, Abhishek, Kumar, Arvind A, Shah, Rahul R, Blankenship, Robert G, Das Sharma, Debendra, Gupta, Ashish, Jue, Darren S, Iyer, Sitaraman V, Safranek, Robert J, Willey, Jeff, Ramanujan, Raj K, Hum, Herbert H, Dhillon, Yuvraj S, Liu, Yen-Cheng, Iyer, Venkatraman, Maddox, Robert A
Year of Publication 14.04.2022
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Year of Publication 14.04.2022
Patent
High performance interconnect
Spink, Aaron T, Johnson, Simon P, Fahim, Bahaa, Nale, William Harry, Beers, Robert, Swanson, Jeffrey C, Geetha, Vedaraman, Spagna, Fulvio, Das, Abhishek, Kumar, Arvind A, Shah, Rahul R, Blankenship, Robert G, Das Sharma, Debendra, Gupta, Ashish, Jue, Darren S, Iyer, Sitaraman V, Safranek, Robert J, Willey, Jeff, Ramanujan, Raj K, Hum, Herbert H, Dhillon, Yuvraj S, Liu, Yen-Cheng, Iyer, Venkatraman, Maddox, Robert A
Year of Publication 08.03.2022
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Year of Publication 08.03.2022
Patent
HIGH PERFORMANCE INTERCONNECT
Spink, Aaron T, Johnson, Simon P, Fahim, Bahaa, Nale, William Harry, Beers, Robert, Swanson, Jeffrey C, Geetha, Vedaraman, Spagna, Fulvio, Das, Abhishek, Kumar, Arvind A, Shah, Rahul R, Blankenship, Robert G, Das Sharma, Debendra, Gupta, Ashish, Jue, Darren S, Iyer, Sitaraman V, Safranek, Robert J, Willey, Jeff, Ramanujan, Raj K, Hum, Herbert H, Dhillon, Yuvraj S, Liu, Yen-Cheng, Iyer, Venkatraman, Maddox, Robert A
Year of Publication 22.04.2021
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Year of Publication 22.04.2021
Patent
HIGH PERFORMANCE INTERCONNECT
Spink, Aaron T, Johnson, Simon P, Fahim, Bahaa, Nale, William Harry, Beers, Robert, Swanson, Jeffrey C, Geetha, Vedaraman, Spagna, Fulvio, Das, Abhishek, Kumar, Arvind A, Shah, Rahul R, Blankenship, Robert G, Das Sharma, Debendra, Gupta, Ashish, Jue, Darren S, Iyer, Sitaraman V, Safranek, Robert J, Willey, Jeff, Ramanujan, Raj K, Hum, Herbert H, Dhillon, Yuvraj S, Liu, Yen-Cheng, Iyer, Venkatraman, Maddox, Robert A
Year of Publication 12.11.2020
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Year of Publication 12.11.2020
Patent
ELECTRICAL MARGINING OF MULTI-PARAMETER HIGH-SPEED INTERCONNECT LINKS WITH MULTI-SAMPLE PROBING
RANGARAJAN THANUNATHAN, KUMAR ARVIND A, CHHABBI SHREESH, IYER VENKATRAMAN
Year of Publication 02.01.2014
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Year of Publication 02.01.2014
Patent