Mechanical property changes in sintered silver films by including copper oxide nanoparticles
Wakamoto, Keisuke, Kumakiri, Yuga, Namazu, Takahiro
Published in Microelectronics and reliability (01.02.2024)
Published in Microelectronics and reliability (01.02.2024)
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Journal Article
Formation of Wavy Crack in Double-Layered Ag and CuO/Ag Sintering Die Attach Assemblies Subjected to Thermal Shock Testing
Yasugi, Daisuke, Wakamoto, Keisuke, Kumakiri, Yuga, Namazu, Takahiro
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
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Journal Article