Enabling FPGA-as-a-Service in the Cloud with hCODE Platform
ZHAO, Qian, AMAGASAKI, Motoki, IIDA, Masahiro, KUGA, Morihiro, SUEYOSHI, Toshinori
Published in IEICE Transactions on Information and Systems (01.02.2018)
Published in IEICE Transactions on Information and Systems (01.02.2018)
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Journal Article
A 3D FPGA Architecture to Realize Simple Die Stacking
Amagasaki, Motoki, Zhao, Qian, Iida, Masahiro, Kuga, Morihiro, Sueyoshi, Toshinori
Published in IPSJ Transactions on System LSI Design Methodology (01.01.2015)
Published in IPSJ Transactions on System LSI Design Methodology (01.01.2015)
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Journal Article
Streaming Accelerator Design for Regular Expression on CPU+FPGA Embedded System
Hendarmawan, Kuga, Morihiro, Iida, Masahiro
Published in ECTI Transactions on Computer and Information Technology (11.10.2022)
Published in ECTI Transactions on Computer and Information Technology (11.10.2022)
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Journal Article
A 3D FPGA Architecture to Realize Simple Die Stacking
Amagasaki, Motoki, Zhao, Qian, Iida, Masahiro, Kuga, Morihiro, Sueyoshi, Toshinori
Published in Information and Media Technologies (01.01.2015)
Published in Information and Media Technologies (01.01.2015)
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Journal Article
A logic cell architecture exploiting the shannon expansion for the reduction of configuration memory
Qian Zhao, Yanagida, Kyosei, Amagasaki, Motoki, Iida, Masahiro, Kuga, Morihiro, Sueyoshi, Toshinori
Published in 2014 24th International Conference on Field Programmable Logic and Applications (FPL) (01.09.2014)
Published in 2014 24th International Conference on Field Programmable Logic and Applications (FPL) (01.09.2014)
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Conference Proceeding
Improving the Robustness of a Softcore Processor against SEUs by Using TMR and Partial Reconfiguration
Ichinomiya, Yoshihiro, Tanoue, Shiro, Amagasaki, Motoki, Iida, Masahiro, Kuga, Morihiro, Sueyoshi, Toshinori
Published in 2010 18th IEEE Annual International Symposium on Field-Programmable Custom Computing Machines (01.01.2010)
Published in 2010 18th IEEE Annual International Symposium on Field-Programmable Custom Computing Machines (01.01.2010)
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Conference Proceeding
Three-dimensional stacking FPGA architecture using face-to-face integration
Hamada, Tetsuro, Qian Zhao, Amagasaki, Motoki, Iida, Masahiro, Kuga, Morihiro, Sueyoshi, Toshinori
Published in 2013 IFIP/IEEE 21st International Conference on Very Large Scale Integration (VLSI-SoC) (01.10.2013)
Published in 2013 IFIP/IEEE 21st International Conference on Very Large Scale Integration (VLSI-SoC) (01.10.2013)
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Conference Proceeding
Defect-robust FPGA architectures for intellectual property cores in system LSI
Amagasaki, Motoki, Inoue, Kazuki, Qian Zhao, Iida, Masahiro, Kuga, Morihiro, Sueyoshi, Toshinori
Published in 2013 23rd International Conference on Field programmable Logic and Applications (01.09.2013)
Published in 2013 23rd International Conference on Field programmable Logic and Applications (01.09.2013)
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Conference Proceeding
FPL Demo: An FPGA-IP Prototype Chip for MEC devices
Kuga, Morihiro, Iida, Masahiro, Amano, Hideharu
Published in 2022 32nd International Conference on Field-Programmable Logic and Applications (FPL) (01.08.2022)
Published in 2022 32nd International Conference on Field-Programmable Logic and Applications (FPL) (01.08.2022)
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Conference Proceeding
PROGRAMMABLE LOGIC CIRCUIT AND METHOD OF CONFIGURING THE SAME
SUEYOSHI TOSHINORI, KUGA MORIHIRO, AMAGASAKI MOTOKI, IIDA MASAHIRO, YANAGIDA KYOSEI
Year of Publication 19.03.2015
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Year of Publication 19.03.2015
Patent
Simple wafer stacking 3D-FPGA architecture
Amagasaki, Motoki, Qian Zhao, Iida, Masahiro, Kuga, Morihiro, Sueyoshi, Toshinori
Published in 2015 International Conference on IC Design & Technology (ICICDT) (01.06.2015)
Published in 2015 International Conference on IC Design & Technology (ICICDT) (01.06.2015)
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Conference Proceeding
SLMLET: A RISC-V Processor SoC with Tightly-Coupled Area-Efficient eFPGA Blocks
Kojima, Takuya, Yanai, Yosuke, Okuhara, Hayate, Amano, Hideharu, Kuga, Morihiro, Iida, Masahiro
Published in 2024 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) (17.04.2024)
Published in 2024 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) (17.04.2024)
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Conference Proceeding