INTERFACE FILM TO MITIGATE SIZE EFFECT OF MEMORY DEVICE
KUANG HSUN CHUNG, TRINH HAI DANG, TSAI CHENG YUAN, WEI YI YANG, LEE BI SHEN
Year of Publication 07.06.2024
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Year of Publication 07.06.2024
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INTERFACE FILM TO MITIGATE SIZE EFFECT OF MEMORY DEVICE
KUANG HSUN CHUNG, TRINH HAI DANG, TSAI CHENG YUAN, WEI YI YANG, LEE BI SHEN
Year of Publication 21.11.2022
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Year of Publication 21.11.2022
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FERROELECTRIC MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
KUANG HSUN CHUNG, TRINH HAI DANG, WEI YI YANG, LEE BI SHEN, LIN TZU YU, LIN HSING LIEN
Year of Publication 02.09.2022
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Year of Publication 02.09.2022
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TOP ELECTRODE VIA WITH LOW CONTACT RESISTANCE
KUANG HSUN CHUNG, TSAI TZU CHUNG, TRINH HAI DANG, CHANG YAO WEN, LEE BI SHEN
Year of Publication 11.08.2021
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Year of Publication 11.08.2021
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FeRAM FERAM WITH LAMINATED FERROELECTRIC FILM AND METHOD FORMING SAME
KUANG HSUN CHUNG, TRINH HAI DANG, TSAI CHENG YUAN, WEI YI YANG, LEE BI SHEN, LIN HSING LIEN
Year of Publication 04.02.2022
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Year of Publication 04.02.2022
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STRUCTURE AND METHOD TO EXPOSE MEMORY CELLS WITH DIFFERENT SIZES
KUANG HSUN CHUNG, CHANG YAO WEN, TSAI CHENG YUAN, CHEN SHENG CHAU, HSIAO CHENG TAI
Year of Publication 05.04.2019
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Year of Publication 05.04.2019
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WAFER BONDING PROCESS AND STRUCTURE
LIU PING YIN, KUANG HSUN CHUNG, CHAO LAN LIN, HUANG XIN HUA, HSIAO CHENG TAI
Year of Publication 02.09.2015
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Year of Publication 02.09.2015
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INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM
LIU PING YIN, KUANG HSUN CHUNG, CHAO LAN LIN, CHEN XIAOMENG, LIN HUNG HUA, TSAI CHIA SHIUNG, HUANG XIN HUA, HSIEH YUAN CHIH
Year of Publication 24.09.2014
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Year of Publication 24.09.2014
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