Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package
Mu-Hsuan Chan, Yi-Chian Liao, Chun-Tang Lin, Kuan-Weir Chuang, Huei-Nuan Huang, Chi-Tung Yeh, Wen-Tsung Tseng, Jeng-Yuan Lai
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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