MMIC-to-Dielectric Waveguide Transitions for Glass Packages Above 150 GHz
Galler, Thomas, Chaloun, Tobias, Mayer, Winfried, Krohnert, Kevin, Ambrosius, Norbert, Schulz-Ruhtenberg, Malte, Waldschmidt, Christian
Published in IEEE transactions on microwave theory and techniques (01.07.2023)
Published in IEEE transactions on microwave theory and techniques (01.07.2023)
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Journal Article
Glass Package for Radar MMICs Above 150 GHz
Galler, Thomas, Chaloun, Tobias, Mayer, Winfried, Krohnert, Kevin, Starukhin, Dzmitry, Ambrosius, Norbert, Schulz-Ruhtenberg, Malte, Waldschmidt, Christian
Published in IEEE journal of microwaves (01.01.2022)
Published in IEEE journal of microwaves (01.01.2022)
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Journal Article
RF Glass Technology Is Going Mainstream: Review and Future Applications
Chaloun, Tobias, Brandl, Susanne, Ambrosius, Norbert, Krohnert, Kevin, Maune, Holger, Waldschmidt, Christian
Published in IEEE journal of microwaves (01.04.2023)
Published in IEEE journal of microwaves (01.04.2023)
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Journal Article
Hermetically Sealed Glass Package for Highly Integrated MMICs
Galler, Thomas, Chaloun, Tobias, Krohnert, Kevin, Schulz-Ruhtenberg, Malte, Waldschmidt, Christian
Published in 2019 49th European Microwave Conference (EuMC) (01.10.2019)
Published in 2019 49th European Microwave Conference (EuMC) (01.10.2019)
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Conference Proceeding
Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages
Gupta, Parnika, Morrissey, Padraic E., O' Brien, Peter, Krohnert, Kevin, Wohrmann, Markus, Schiffer, Michael, Kelb, Christian, Ambrosius, Norbert, Schneider-Ramelow, Martin
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai, Mackowiak, Piotr, Ngo, Ha-Duong, Tschoban, Christian, Fritsche, Carola, Krohnert, Kevin, Fischer, Thorsten, Ndip, Ivan, Lang, Klaus-Dieter
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform
Krohnert, Kevin, Friedrich, Georg, Starukhin, Dzmitry, Wohrmann, Markus, Schiffer, Michael, Schneider-Ramelow, Martin
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
High Aspect Ratio Through-Glass Vias as Heat Conductive Element
Krohnert, Kevin, Wohrmann, Markus, Schiffer, Michael, Kelb, Christian, Ambrosius, Norbert, Gupta, Parnika, Morrissey, Padraic E., O'Brien, Peter, Schneider-Ramelow, Martin
Published in 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (12.06.2022)
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Published in 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (12.06.2022)
Conference Proceeding
High Density Thin Film Flex Technology for Advanced Packaging Applications
Zoschke, Kai, Oppermann, Hermann, Wohrmann, Markus, Kallmayer, Christine, Tschoban, Christian, Krohnert, Kevin, Lopper, Christina, Jaeger, Danny, Lutz, Mario, Wunsch, Olaf
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Versatile Hermetically Sealed Sensor Platform for High Frequency Applications
Krohnert, Kevin, Wohrmann, Markus, Schiffer, Michael, Friedrich, Georg, Starukhin, Dzmitry, Schneider-Ramelow, Martin, Mayer, Winfried, Chaloun, Tobias, Galler, Thomas, Waldschmidt, Christian, Schulz-Ruhtenberg, Malte, Ambrosius, Norbert, Hansen, Ulli
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
Zoschke, Kai, Mackowiak, Piotr, Krohnert, Kevin, Oppermann, Hermann, Jurgensen, Nils, Wietstruck, Matthias, Goritz, Alexander, Tolunay Wipf, Selin, Kaynak, Mehmet, Lang, Klaus-Dieter
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
Zoschke, Kai, Mackowiak, Piotr, Ngo, Ha-Duong, Tschoban, Christian, Fritsche, Carola, Ndip, Ivan, Krohnert, Kevin, Lang, Klaus-Dieter
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
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Conference Proceeding