Mechanically fixed and thermally insulated micromechanical structures for GaAs heterostructure based MEMS devices
Lalinsky´, T, Haš ík, S, Mozolová, ., Burian, E, Krná, M, Tomáška, M, Škriniarová, J, Drz ík, M, Kostic, I, Matay, L
Published in Microelectronics international (01.04.2003)
Published in Microelectronics international (01.04.2003)
Get full text
Journal Article