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Year of Publication 19.04.2024
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Year of Publication 19.04.2024
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Year of Publication 04.04.2024
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Year of Publication 04.04.2024
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전자 어셈블리들 및 이를 제조하는 방법들
LI YONG GUO, BHANDARI RISHABH, KRITHIVASAN VIJAYKUMAR, NABOVATI AYDIN, CHANG WILLIAM
Year of Publication 07.03.2024
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Year of Publication 07.03.2024
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웨이퍼 정렬 구조
LI YONG GUO, BHANDARI RISHABH, HESCHKE MITCHELL, KRITHIVASAN VIJAYKUMAR, ROSENBERG RON, NABOVATI AYDIN
Year of Publication 31.10.2023
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Year of Publication 31.10.2023
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정전기 방전 및/또는 전자기 간섭의 영향들을 감소시키기 위한 수단이 있는 냉각된 시스템-온-웨이퍼
LI YONG GUO, BHANDARI RISHABH, KRITHIVASAN VIJAYKUMAR, NAVARRETE RODRIGO RODRIGUEZ, LI JIANJUN, SUN YANG, PANG MENGZHI
Year of Publication 08.11.2023
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Year of Publication 08.11.2023
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효율적인 가스 분배 조립체 냉각을 위한 동심형 또는 나선형 채널을 갖는 2구역 유동 냉각 플레이트 설계
HOLLA NISHA PRAKASH, SUBRAMANI ANANTHA K, KRITHIVASAN VIJAYKUMAR, NOORBAKHSH HAMID, SHAH KARTIK
Year of Publication 02.07.2019
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Year of Publication 02.07.2019
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Fundamentals based approach to predict socket stack performance
Meyyappan, Karumbu, McAllister, Alan, Abraham, Amit, Krithivasan, Vijaykumar, Murtagian, Gregorio
Published in 2014 IEEE 60th Holm Conference on Electrical Contacts (Holm) (01.10.2014)
Published in 2014 IEEE 60th Holm Conference on Electrical Contacts (Holm) (01.10.2014)
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Conference Proceeding
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LU CHIH SHUN, TAE PATRICK JOHN, CHAN KELVIN, KRITHIVASAN VIJAYKUMAR, WILLWERTH MICHAEL D, PAN YAOLING, KRAUS PHILIP ALLAN, MAO SHIMIN, SUBRAMANI ANANTHA, GOEL ASHISH, TEDESCHI LEONARD
Year of Publication 27.09.2019
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Year of Publication 27.09.2019
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MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS
KRITHIVASAN VIJAYKUMAR, LLAPITAN DAVID J, CHAWLA GAURAV, TRAN DONALD T, AULAKH TEJINDER PAL, SMALLEY JEFFORY L
Year of Publication 29.06.2016
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Year of Publication 29.06.2016
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TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY
KRITHIVASAN VIJAYKUMAR, SWAMINATHAN RAJASEKARAN, CHAWLA GAURAV, LIU KUANG C, GARCIA MICHAEL, HEPPNER JOSHUA D
Year of Publication 22.03.2016
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Year of Publication 22.03.2016
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ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES
THIBADO JONATHAN W, KRITHIVASAN VIJAYKUMAR, LLAPITAN DAVID J, MURTAGIAN GREGORIO, CHAWLA GAURAV, SMALLEY JEFFORY L, HEPPNER JOSHUA D, LIU KUANG
Year of Publication 06.07.2016
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Year of Publication 06.07.2016
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SANDWICHED MULTI-LAYER STRUCTURE FOR COOLING HIGH POWER ELECTRONICS
NASR, Mohamed, HESCHKE, Mitchell, NABOVATI, Aydin, GAO, Zheng, KRITHIVASAN, Vijaykumar
Year of Publication 26.06.2024
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Year of Publication 26.06.2024
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SANDWICHED MULTI-LAYER STRUCTURE FOR COOLING HIGH POWER ELECTRONICS
NASR, Mohamed, HESCHKE, Mitchell, NABOVATI, Aydin, GAO, Zheng, KRITHIVASAN, Vijaykumar
Year of Publication 23.02.2023
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Year of Publication 23.02.2023
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