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Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Copper descaling capability and material decision
bin Mohd Salleh, Ronizan, Krishnan, Jagen
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
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Method for Forming a Matrix Composite Layer and Workpiece With a Matrix Composite Layer
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Year of Publication 18.10.2018
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Year of Publication 29.07.2020
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Year of Publication 12.05.2020
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HEAT SINK ARRANGEMENT
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Year of Publication 01.04.2020
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METHOD FOR FORMING A COMPOSITE LAYER
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Year of Publication 25.03.2020
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Selective Plating of Semiconductor Package Leads
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Year of Publication 16.01.2020
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METHOD FOR FORMING A COMPOSITE LAYER AND WORKPIECE WITH A COMPOSITE LAYER
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Year of Publication 06.11.2019
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Year of Publication 06.11.2019
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METHOD FOR FORMING A COMPOSITE LAYER AND WORKPIECE WITH A COMPOSITE LAYER
Narayanasamy, Jayaganasan, Lau, Kok Tee, Murugan, Sanjay Kumar, Lee, Hong Lim, Krishnan, Jagen
Year of Publication 17.10.2018
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Year of Publication 17.10.2018
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Assembly for handling a semiconductor die and method of handling a semiconductor die
Tan, Kian Heong, Tong, Soon Hock, Oliveros Sumagpoa, Avelino, Lee, Kuang Ming, Paramio Joves, Ronald, Vergara Bicomong, Nestor, Kunamani, Thanabal Ganesh, Krishnan, Jagen
Year of Publication 09.10.2018
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Year of Publication 09.10.2018
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Embedding additive particles in encapsulant of electronic device
Tan Yik Yee, Mahler Joachim, Teh Peh Hean, Krishnan Jagen, Tai Chew Theng, Lee Swee Kah, Goh Soon Lock, Lim Poh Cheng
Year of Publication 26.12.2017
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Year of Publication 26.12.2017
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Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
Tan Yik Yee, Mahler Joachim, Teh Peh Hean, Tai Chew Theng, Krishnan Jagen, Lee Swee Kah, Goh Soon Lock, Lim Poh Cheng
Year of Publication 10.01.2017
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Year of Publication 10.01.2017
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Selective Plating of Semiconductor Package Leads
ABD HAMID SYAHIR, KRISHNAN JAGEN, SCHNOY FABIAN, STOEK THOMAS, NARAYANASAMY JAYAGANASAN, LAM MIAN MIAN, STUEMPFL CHRISTIAN
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Year of Publication 24.01.2020
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Embedding additive particles in encapsulant of electronic device
MAHLER JOACHIM, GOH SOON LOCK, LEE SWEE KAH, KRISHNAN JAGEN, TAI CHEW THENG, LIM POH CHENG, TEH PEH HEAN, TAN YIK YEE
Year of Publication 03.03.2016
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Year of Publication 03.03.2016
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