by Veninga, E. P., Kregting, R., van der Waal, A., Gielen, A. W. J.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)

by Kregting, R, Yuan, Cadmus, An Xiao, de Bruijn, F
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)

by Kregting, R., Erinc, M., Kloosterman, J., van Driel, W.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)

by Yuan, C., Kregting, R., Huaiyu Ye, van Driel, W., Gielen, S., Zhang, G. Q.
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)

by Kregting, K., van Silfhout, R.B.R., van der Sluis, O., Engelen, R.A.B., van Driel, W.D., Zhang, G.Q.
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)