Novel 3D manufacturing method combining microelectrial discharge machining and electrochemical polishing
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Year of Publication 10.07.2019
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Genauigkeitssteigerung bei Messungen in Zweiflankenanlage
Wedmann, Achim, Kniel, Karin, Krah, Thomas, Härtig, Frank
Published in Technisches Messen (28.08.2014)
Published in Technisches Messen (28.08.2014)
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Bonded wafer metrology
Sah, Kaushik, Eisenbach, Heiko, Krah, Thomas, Stoerring, Moritz, Li, Shifang
Year of Publication 21.01.2020
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Year of Publication 21.01.2020
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Trends bei der Entwicklung von Normalen für die Mikro- und Nanomesstechnik: Herausforderungen und Lösungsansätze (Trends in Development of Standards for Micro- and Nanometrology: Chances and Challenges)
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Published in Technisches Messen (01.05.2008)
Published in Technisches Messen (01.05.2008)
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BONDED WAFER METROLOGY
SAH, Kaushik, EISENBACH, Heiko, KRAH, Thomas, LI, Shifang, STOERRING, Moritz
Year of Publication 15.04.2020
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Year of Publication 15.04.2020
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Bonded Wafer Metrology
Sah, Kaushik, Eisenbach, Heiko, Krah, Thomas, Stoerring, Moritz, Li, Shifang
Year of Publication 31.05.2018
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Year of Publication 31.05.2018
Patent
BONDED WAFER METROLOGY
SAH, Kaushik, EISENBACH, Heiko, KRAH, Thomas, LI, Shifang, STOERRING, Moritz
Year of Publication 10.07.2019
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Year of Publication 10.07.2019
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BONDED WAFER METROLOGY
SAH, Kaushik, EISENBACH, Heiko, KRAH, Thomas, LI, Shifang, STOERRING, Moritz
Year of Publication 07.06.2018
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Year of Publication 07.06.2018
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Metrology system, method for wafer metrology, and non-transitory computer readable medium
KRAH, THOMAS, STOERRING, MORITZ, SAH, KAUSHIK, LI, SHIFANG, EISENBACH, HEIKO
Year of Publication 21.06.2021
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Year of Publication 21.06.2021
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BONDED WAFER METROLOGY
SAH KAUSHIK, LI SHIFANG, STOERRING MORITZ, KRAH THOMAS, EISENBACH HEIKO
Year of Publication 02.07.2019
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Year of Publication 02.07.2019
Patent
Bonded wafer metrology
KRAH, THOMAS, STOERRING, MORITZ, SAH, KAUSHIK, LI, SHIFANG, EISENBACH, HEIKO
Year of Publication 01.08.2018
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Year of Publication 01.08.2018
Patent