Advanced flip chip bonding techniques using transferred microsolder bumps
Koshoubu, N., Ishizawa, S., Tsunetsugu, H., Takahara, H.
Published in IEEE transactions on components and packaging technologies (01.06.2000)
Published in IEEE transactions on components and packaging technologies (01.06.2000)
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Journal Article
Variations of mechanical properties in egg white during gel-to-glasslike transition
KOSHOUBU, N, KANAYA, H, HARA, K, TAKI, S, TAKUSHI, E, MATSUSHIGE, K
Published in Japanese Journal of Applied Physics (1993)
Published in Japanese Journal of Applied Physics (1993)
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Journal Article
Some Features in Gel Drying Process and Dehydrated Substances
Hara, Kazuhiro, Kanaya, Haruichi, Masuike, Takeo, Koshoubu, Nobutatsu, Okabe, Hirotaka, Kai, Shoichi, Nakamura, Atsushi, Hiramatsu, Nobuyasu, Nishida, Tetsuaki, Takushi, Eisei
Published in Progress of theoretical physics. Supplement (01.01.1997)
Published in Progress of theoretical physics. Supplement (01.01.1997)
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Journal Article
Optoelectronic chip on film (OE-COF) packaging technology
Takahara, H., Koshoubu, N., Hirata, H., Ishizawa, S., Ishibashi, S., Tsunetsugu, H.
Published in 1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009) (1999)
Published in 1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009) (1999)
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Conference Proceeding