ELECTRICAL INTERCONNECT FOR ELECTRONIC PACKAGE
YONG KHANG CHOONG, KOOI CHI OOI, BEH TEONG KEAT, HOWARD L HECK, BOK ENG CHEAH, JACKSON CHUNG PENG KONG, STEPHEN H HALL
Year of Publication 30.05.2016
Get full text
Year of Publication 30.05.2016
Patent
A novel inter-package connection for advanced package-on-package enabling
Bok Eng Cheah, Kong, Jackson, Periaman, Shanggar, Kooi Chi Ooi
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Get full text
Conference Proceeding
Signal integrity study of high density through silicon via (TSV) technology
Bok Eng Cheah, Kong, Jackson, Chee Kit Chew, Kooi Chi Ooi, Periaman, Shanggar
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
Signal integrity and scalability study of a novel PoP inter-package system
Kong, J., Bok Eng Cheah, Periaman, S., Kooi Chi Ooi
Published in 2011 3rd Asia Symposium on Quality Electronic Design (ASQED) (01.07.2011)
Published in 2011 3rd Asia Symposium on Quality Electronic Design (ASQED) (01.07.2011)
Get full text
Conference Proceeding
MICROELECTRONICS PACKAGE WITH A COMBINATION HEAT SPREADER/RADIO FREQUENCY SHIELD
CHEAH, Bok Eng, OOI, Ping Ping, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 29.04.2024
Get full text
Year of Publication 29.04.2024
Patent
DEVICES AND METHODS FOR SIGNAL INTEGRITY PROTECTION TECHNIQUE
YONG, Khang Choong, CHEAH, Bok Eng, LIM, Min Suet, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 19.04.2024
Get full text
Year of Publication 19.04.2024
Patent
Encapsulated vertical interconnects for high-speed applications and methods of assembling same
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Poh, Yang Liang
Year of Publication 30.01.2024
Get full text
Year of Publication 30.01.2024
Patent
Substrate with gradiated dielectric for reducing impedance mismatch
Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi, Ooi, Ping Ping
Year of Publication 05.12.2023
Get full text
Year of Publication 05.12.2023
Patent
Devices and methods for signal integrity protection technique
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Min Suet, Yong, Khang Choong
Year of Publication 24.10.2023
Get full text
Year of Publication 24.10.2023
Patent
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 11.07.2024
Get full text
Year of Publication 11.07.2024
Patent
ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 04.07.2024
Get full text
Year of Publication 04.07.2024
Patent
Integrated bridge for die-to-die interconnects
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 04.06.2024
Get full text
Year of Publication 04.06.2024
Patent
EMBEDDED VOLTAGE REFERENCE PLANE FOR SYSTEM-IN-PACKAGE APPLICATIONS
CHEAH, Bok Eng, OOI, Ping Ping, ONG, Paik Wen, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 24.06.2023
Get full text
Year of Publication 24.06.2023
Patent
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 02.05.2024
Get full text
Year of Publication 02.05.2024
Patent
ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 02.05.2024
Get full text
Year of Publication 02.05.2024
Patent
EMBEDDED REFERENCE LAYERS FO SEMICONDUCTOR PACKAGE SUBSTRATES
KONG, JACKSON CHUNG PENG, OOI, KOOI CHI, ONG, JENNY SHIO YIN, CHEAH, BOK ENG, LIM, SEOK LING
Year of Publication 27.04.2024
Get full text
Year of Publication 27.04.2024
Patent
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 25.04.2024
Get full text
Year of Publication 25.04.2024
Patent