A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling
Kong, Daeyoung, Kim, Yunseo, Kang, Minsoo, Song, Erdong, Hong, Yongtaek, Kim, Han Sang, Rah, Kyupaeck Jeff, Choi, Hyoung Gil, Agonafer, Damena, Lee, Hyoungsoon
Published in Case studies in thermal engineering (01.12.2021)
Published in Case studies in thermal engineering (01.12.2021)
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Journal Article
Nano-size structure formation on Si substrate for optical device application
DaeYoung Kong, JungHwa Oh, BongHwan Kim, ChanSeob Cho, JongHyun Lee
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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Conference Proceeding
Fabrication of superhydrophobic surface using surface texturing with nano-sized structure and PTFE film
JungHwa Oh, DaeYoung Kong, SungBo Seo, DongYoung Kim, HwaMin Kim, ChanSeob Cho, JongHyun Lee, Bonghwan Kim
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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Conference Proceeding
Fabrication of BeCu module probe array using heating and fusing currents
Dongin Lee, Sangwon Kim, Daeyoung Kong, Chanseob Cho, Bonghwan Kim, Byeungleul Lee, Jonghyun Lee
Published in 2011 IEEE SENSORS Proceedings (01.10.2011)
Published in 2011 IEEE SENSORS Proceedings (01.10.2011)
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Conference Proceeding
Design and fabrication of MEMS test socket for BGA IC packages
Sangwon Kim, Daeyoung Kong, Chanseob Cho, Jaewoo Nam, Bonghwan Kim, Jonghyun Lee
Published in 2010 IEEE Sensors (01.11.2010)
Published in 2010 IEEE Sensors (01.11.2010)
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Conference Proceeding
Analysis of the enhancing mechanism in pool boiling heat transfer through wetting speed for rough aluminum surfaces with FC-72
Kim, Jun, Yeom, Jeongwoo, Kong, Daeyoung, Lee, Hyoungsoon, Kim, Seok-min
Published in International journal of heat and mass transfer (01.04.2020)
Published in International journal of heat and mass transfer (01.04.2020)
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Journal Article
An additively manufactured manifold-microchannel heat sink for high-heat flux cooling
Kong, Daeyoung, Jung, Euibeen, Kim, Yunseo, Manepalli, Vivek Vardhan, Rah, Kyupaeck Jeff, Kim, Han Sang, Hong, Yongtaek, Choi, Hyoung Gil, Agonafer, Damena, Lee, Hyoungsoon
Published in International journal of mechanical sciences (15.06.2023)
Published in International journal of mechanical sciences (15.06.2023)
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Journal Article
Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
Kim, Kiwan, Kong, Daeyoung, Kim, Yunseo, Jang, Bongho, Cho, Jungwan, Kwon, Hyuk-Jun, Lee, Hyoungsoon
Published in Applied thermal engineering (15.03.2024)
Published in Applied thermal engineering (15.03.2024)
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Journal Article
Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits
Jung, Daewoong, Lee, Haeun, Kong, Daeyoung, Cho, Eunho, Jung, Ki Wook, Kharangate, Chirag R., Iyengar, Madhusudan, Malone, Chris, Asheghi, Mehdi, Goodson, Kenneth E., Lee, Hyoungsoon
Published in International journal of heat and mass transfer (01.08.2021)
Published in International journal of heat and mass transfer (01.08.2021)
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Journal Article