Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface
Liu, Y, Wang, J, Yin, L, Kondos, P, Parks, C, Borgesen, P, Henderson, D W, Cotts, E J, Dimitrov, N
Published in Journal of applied electrochemistry (01.12.2008)
Published in Journal of applied electrochemistry (01.12.2008)
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Process optimization studies in gold cyanidation
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Conference Proceeding
Bio-reduction of elemental sulfur to increase the gold recovery from enargite
Hol, Alex, van der Weijden, Renata D., Van Weert, Gus, Kondos, Peter, Buisman, Cees J.N.
Published in Hydrometallurgy (01.03.2012)
Published in Hydrometallurgy (01.03.2012)
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Bio-reduction of pyrite investigated in a gas lift loop reactor
Hol, A, Weijden, R.D., van der, Weert, G., van, Kondos, P, Buisman, C.J.N
Published in International journal of mineral processing (2010)
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Published in International journal of mineral processing (2010)
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The effect of anaerobic processes on the leachability of an arsenopyrite refractory ore
Hol, Alex, van der Weijden, Renata D., Weert, Gus Van, Kondos, Peter, Buisman, Cees J.N.
Published in Minerals engineering (01.05.2011)
Published in Minerals engineering (01.05.2011)
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Journal Article
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface: Plating in acidic copper solution with and without polyethylene glycol
Liu, Y., Wang, J., Yin, L., Kondos, P., Parks, C., Borgesen, P., Henderson, D. W., Cotts, E. J., Dimitrov, N.
Published in Journal of applied electrochemistry (01.12.2008)
Published in Journal of applied electrochemistry (01.12.2008)
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Journal Article
Improving Copper Electrodeposition in the Microelectronics Industry
Yihua Liu, Liang Yin, Bliznakov, S., Kondos, P., Borgesen, P., Henderson, D.W., Parks, C., Ju Wang, Cotts, E.J., Dimitrov, N.
Published in IEEE transactions on components and packaging technologies (01.03.2010)
Published in IEEE transactions on components and packaging technologies (01.03.2010)
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Journal Article
On the evolution of the properties and microstructure of backward compatible solder joints during cycling and aging
Jaradat, Y., Qasaimeh, A., Kondos, P., Arfaei, B., Borgesen, P.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Sporadic Degradation in Board Level Drop Reliability - Those Aren't All Kirkendall Voids
Borgesen, P., Liang Yin, Kondos, P., Henderson, D.W., Servis, G., Ju Wang, Srihari, K.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Improving copper electrodeposition in the microelectronics industry
Liu, Y., Wang, J., Yin, L., Kondos, P., Parks, C., Borgesen, P., Henderson, D.W., Bliznakov, S., Cotts, E.J., Dimitrov, N.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Controlling Cu electroplating to prevent sporadic voiding in Cu3Sn
Liang Yin, Kondos, P., Borgesen, P., Yihua Liu, Bliznakov, S., Wafula, F., Dimitrov, N., Henderson, D.W., Parks, C., Mao Gao, Therriault, J., Ju Wang, Cotts, E.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding