Challenges for Enabling Multiple High-Speed Interfaces On A Reference Validation Platform
Kondapuram, Esha, Ong, Chong-Jin, Silva, Benjamin, Lambacher, Brandon
Published in 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2022)
Published in 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2022)
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