Sintering of oxide-free copper pastes for the attachment of SiC power devices
Carro, Luca Del, Liu, Chunlei, Koller, Fabio, Zinn, Alfred A., Brunschwiler, Thomas
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
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