Composite coating structure in an implantable electronic device
Kokko, Kati, Harjunpää, Hanna, Heino, Pekka, Kellomäki, Minna
Published in Soldering & surface mount technology (26.06.2009)
Published in Soldering & surface mount technology (26.06.2009)
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Journal Article
Corrosion protection of anisotropically conductive adhesive joined flip chips
Kokko, Kati, Parviainen, Anniina, Frisk, Laura
Published in Microelectronics and reliability (01.08.2010)
Published in Microelectronics and reliability (01.08.2010)
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Journal Article
Thermal cycling of flip chips on FR-4 and PI substrates with parylene C coating
Kokko, Kati, Frisk, Laura, Heino, Pekka
Published in Soldering & surface mount technology (01.01.2010)
Published in Soldering & surface mount technology (01.01.2010)
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Journal Article
Thermal cycling of flip chips on FR4 and PI substrates with parylene C coating
Kokko, Kati, Frisk, Laura, Heino, Pekka
Published in Soldering & surface mount technology (29.06.2010)
Published in Soldering & surface mount technology (29.06.2010)
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Journal Article
Wireless and inductively powered implant for measuring electrocardiogram
Riistama, Jarno, Väisänen, Juho, Heinisuo, Sami, Harjunpää, Hanna, Arra, Satu, Kokko, Kati, Mäntylä, Maunu, Kaihilahti, Jutta, Heino, Pekka, Kellomäki, Minna, Vainio, Outi, Vanhala, Jukka, Lekkala, Jukka, Hyttinen, Jari
Published in Medical & biological engineering & computing (01.12.2007)
Published in Medical & biological engineering & computing (01.12.2007)
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Journal Article
Influence of medical sterilization on ACA flip chip joints using conformal coating
Kokko, Kati, Harjunpää, Hanna, Heino, Pekka, Kellomäki, Minna
Published in Microelectronics and reliability (01.01.2009)
Published in Microelectronics and reliability (01.01.2009)
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Journal Article
Combining humidity testing and static bending with flip chip test structures
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Conference Proceeding
Effects of failure criteria on the constant humidity test results
Kokko, K, Frisk, L
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Liquid crystal polymer as a substrate material for flip chip ACA interconnections
Frisk, L, Parviainen, A, Kokko, K
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Hydrolysis testing of ACF joined flip chip components with conformal coating
Kokko, K., Harjunpaa, H., Heino, P., Kellomaki, M.
Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
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Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
Conference Proceeding