by Liew, K.W., Kok, C.K., Ervina Efzan, M.N.
Published in Tribology international (01.09.2016)

by N, Siti Syazwani, M N, Ervina Efzan, C K, Kok, M J, Nurhidayatullaili
Published in F1000 research (2024)

by Tso, C.P., Hor, C.H., Chen, G.M., Kok, C.K.
Published in Heliyon (01.12.2018)

by Siti Syazwani, N., Ervina Efzan, M.N., Kok, C.K., Nurhidayatullaili, M.J.
Published in Journal of Building Engineering (01.05.2022)

by Eaki, M., Kadirgama, K., Ramasamy, Devarajan, Wan harun, Wan Sharuzi, El Hossein, Khaled Abou, Samylingam, L., Kok, C.K.
Published in International journal of automotive and mechanical engineering (20.03.2024)

by Liew, K.W., Chia, S.Y., Kok, C.K., Low, K.O.
Published in Materials in engineering (01.06.2013)

by Liew, K.W., Kong, H.J., Low, K.O., Kok, C.K., Lee, Derric
Published in Materials in engineering (01.10.2014)

by Chin, J.W.C., Kok, C.K., Rajmohan, M.M., Yeo, V.S.H., Said, M.R.
Published in Journal of electronic materials (01.04.2012)

by Shin, H.-W., Kwon, P., Kok, C.K., Case, E.
Published in Journal of manufacturing processes (2004)

by Kok, C.K., Chew, W.C., Chim, W.K., Chan, D.S.H., Leang, S.E.
Published in Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394) (1999)

by Zhou, Z., Cheok, A.D., Lee, S.P., Thang, L.N., Kok, C.K., Ng, W.Z., Cher, Y.K., Pung, M.L., Li, Y.
Published in Proceedings of the 2005 International Conference on Active Media Technology, 2005. (AMT 2005) (2005)