Investigation of continuous deformation behavior around initial yield point of single crystal copper by using micro scale torsion test
Koiwa, Kozo, Shishido, Nobuyuki, Chen, Chuantong, Omiya, Masaki, Kamiya, Shoji, Sato, Hisashi, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Suzuki, Toshiaki, Nokuo, Takeshi
Published in Scripta materialia (15.01.2016)
Published in Scripta materialia (15.01.2016)
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Journal Article
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits
Kamiya, Shoji, Shishido, Nobuyuki, Watanabe, Shinsuke, Sato, Hisashi, Koiwa, Kozo, Omiya, Masaki, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Nokuo, Takeshi, Nagasawa, Tadahiro
Published in Surface & coatings technology (25.01.2013)
Published in Surface & coatings technology (25.01.2013)
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Journal Article
Conference Proceeding
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures
Omiya, Masaki, Koiwa, Kozo, Shishido, Nobuyuki, Kamiya, Shoji, Chen, Chuantong, Sato, Hisashi, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Suzuki, Toshiaki, Nokuo, Takeshi
Published in Microelectronics and reliability (01.04.2013)
Published in Microelectronics and reliability (01.04.2013)
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Journal Article
Specimen Size Effect of Interface Strength Distribution Induced by Grain Structure of Cu Line
CHEN, Chuantong, SHISHIDO, Nobuyuki, KOIWA, Kozo, KAMIYA, Shoji, SATO, Hisashi, NISHIDA, Masahiro, OMIYA, Masaki, SUZUKI, Takashi, NAKAMURA, Tomoji, SUZUKI, Toshiaki, NOKUO, Takeshi
Published in TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A (2013)
Published in TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A (2013)
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Journal Article
Evaluation of Mode I Fiber/Matrix Interfacial Fracture Toughness and Matrix Toughness in FRP by Using Real-Size Model Composites
KOIWA, Kozo, TANAKA, Hiroshi, NAKAI, Yoshikazu, ITO, Shinya
Published in TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A (2011)
Published in TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A (2011)
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Journal Article
THREE-DIMENSIONAL LAMINATE MOLDING DEVICE AND THREE-DIMENSIONAL LAMINATE MOLDING METHOD
SATO TAKASHI, KAWAKAMI MASAHIKO, DAINO YOHEI, TSUTAGAWA NARI, KOIWA KOZO, KANEKO YUHEI
Year of Publication 26.01.2023
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Year of Publication 26.01.2023
Patent
THREE-DIMENSIONAL LAMINATE MOLDING APPARATUS AND THREE-DIMENSIONAL LAMINATE MOLDING METHOD
SATO TAKASHI, KAWAKAMI MASAHIKO, KITAMURA SHINICHI, DAINO YOHEI, MIYAKITA AYUMI, HISAKI TAKU, TSUTAGAWA NARI, KOIWA KOZO
Year of Publication 26.09.2022
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Year of Publication 26.09.2022
Patent
THREE-DIMENSIONAL LAMINATE MOLDING APPARATUS AND THREE-DIMENSIONAL LAMINATE MOLDING METHOD
SATO TAKASHI, KAWAKAMI MASAHIKO, KITAMURA SHINICHI, DAINO YOHEI, MIYAKITA AYUMI, HISAKI TAKU, TSUTAGAWA NARI, KOIWA KOZO
Year of Publication 26.09.2022
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Year of Publication 26.09.2022
Patent
Local distribution of residual stress of Cu in LSI interconnect
Sato, Hisashi, Shishido, Nobuyuki, Kamiya, Shoji, Koiwa, Kozo, Omiya, Masaki, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Nokuo, Takeshi
Published in Materials letters (01.12.2014)
Published in Materials letters (01.12.2014)
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Journal Article
Specimen size effect on elastic–plastic strength evaluation of interface between thin films
Chen, Chuantong, Koiwa, Kozo, Shishido, Nobuyuki, Kamiya, Shoji, Omiya, Masaki, Sato, Hisashi, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Nokuo, Takeshi, Nagasawa, Tadahiro
Published in Engineering fracture mechanics (01.11.2014)
Published in Engineering fracture mechanics (01.11.2014)
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Journal Article
Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer
Shishido, Nobuyuki, Oura, Yuka, Sato, Hisashi, Kamiya, Shoji, Koiwa, Kozo, Omiya, Masaki, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Nokuo, Takeshi, Suzuki, Toshiaki
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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Journal Article
Conference Proceeding
Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects
Chen, Chuantong, Shishido, Nobuyuki, Kamiya, Shoji, Koiwa, Kozo, Sato, Hisashi, Omiya, Masaki, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Nokuo, Takeshi, Suzuki, Toshiaki
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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Journal Article
Conference Proceeding
Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity
Koiwa, Kozo, Omiya, Masaki, Shishido, Nobuyuki, Kamiya, Shoji, Sato, Hisashi, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Suzuki, Toshiaki, Nokuo, Takeshi
Published in Japanese Journal of Applied Physics (01.04.2013)
Published in Japanese Journal of Applied Physics (01.04.2013)
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Journal Article
Scenario for catastrophic failure in interconnect structures under chip package interaction
Omiya, Masaki, Kamiya, Shoji, Shishido, Nobuyuki, Koiwa, Kozo, Sato, Hisashi, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Suzuki, Toshiaki, Nokuo, Takeshi
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Three-dimensional powder bed fusion additive manufacturing apparatus and three-dimensional powder bed fusion additive manufacturing method
Koiwa, Kozo, Tsutagawa, Nari, Hisaki, Taku, Sato, Takashi, Miyakita, Ayumu, Daino, Yohei, Kawakami, Masahiko, Kitamura, Shinichi
Year of Publication 23.01.2024
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Year of Publication 23.01.2024
Patent