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Year of Publication 05.06.2018
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METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCTIVE LAYER
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Year of Publication 03.11.2016
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Method for depositing a diffusion barrier layer and a metal conductive layer
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Year of Publication 12.07.2016
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Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features
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Year of Publication 17.04.2012
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Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
Chiang, Tony, Yao, Gongda, Ding, Peijun, Chen, Fusen E, Chin, Barry L, Kohara, Gene Y, Xu, Zheng, Zhang, Hong
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Year of Publication 02.08.2011
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Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
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Year of Publication 14.09.2010
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Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
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Year of Publication 02.08.2011
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Method of depositing a sculptured copper seed layer
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Year of Publication 15.09.2009
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Year of Publication 15.09.2009
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Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
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Year of Publication 07.10.2010
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Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
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Year of Publication 14.09.2010
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Method of depositing a metal seed layer on semiconductor substrates
Chiang, Tony, Yao, Gongda, Ding, Peijun, Chen, Fusen E, Chin, Barry L, Kohara, Gene Y, Xu, Zheng, Zhang, Hong
Year of Publication 03.06.2008
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Year of Publication 03.06.2008
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Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
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Year of Publication 29.10.2009
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Method of depositing a sculptured copper seed layer
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
Year of Publication 15.09.2009
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Year of Publication 15.09.2009
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Metal / metal nitride barrier layer for semiconductor device applications
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Year of Publication 30.03.2010
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Metal / metal nitride barrier layer for semiconductor device applications
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