Lead-frames copper oxidation effect for a QFN package delamination improvement
Min-Fong Shu, Koduck Chen, Bret Yang, Liu, Webber, Yi-Hsiu Tseng
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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