An overview of through-silicon-via technology and manufacturing challenges
Gambino, Jeffrey P., Adderly, Shawn A., Knickerbocker, John U.
Published in Microelectronic engineering (05.03.2015)
Published in Microelectronic engineering (05.03.2015)
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Journal Article
Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers
Doany, F. E., Schow, C. L., Lee, B. G., Budd, R. A., Baks, C. W., Tsang, C. K., Knickerbocker, J. U., Dangel, R., Chan, B., How Lin, Carver, C., Jianzhuang Huang, Berry, J., Bajkowski, D., Libsch, F., Kash, J. A.
Published in Journal of lightwave technology (15.02.2012)
Published in Journal of lightwave technology (15.02.2012)
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CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
Sakuma, Katsuyuki, Hu, Huan, Liu, Xiao Hu, Ni, Jiamin, Bedell, Stephen W., Webb, Bucknell, Wright, Steven L., Lauro, Paul, Latzko, Ken, Agno, Marlon, Tornello, James, Knickerbocker, John U.
Published in IEEE sensors journal (15.09.2019)
Published in IEEE sensors journal (15.09.2019)
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An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects
Dickson, T. O., Yong Liu, Rylov, S. V., Bing Dang, Tsang, C. K., Andry, P. S., Bulzacchelli, J. F., Ainspan, H. A., Xiaoxiong Gu, Turlapati, L., Beakes, M. P., Parker, B. D., Knickerbocker, J. U., Friedman, D. J.
Published in IEEE journal of solid-state circuits (01.04.2012)
Published in IEEE journal of solid-state circuits (01.04.2012)
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Conference Proceeding
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias
Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Buchwalter, L.P., Sprogis, E.J., Hua Gan, Horton, R.R., Polastre, R.J., Wright, S.L., Cotte, J.M.
Published in IEEE journal of solid-state circuits (01.08.2006)
Published in IEEE journal of solid-state circuits (01.08.2006)
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Conference Proceeding
Development of vacuum underfill technology for a 3D chip stack
Sakuma, Katsuyuki, Kohara, Sayuri, Sueoka, Kuniaki, Orii, Yasumitsu, Kawakami, Mikio, Asai, Kazuo, Hirayama, Yoshikazu, Knickerbocker, John U
Published in Journal of micromechanics and microengineering (01.03.2011)
Published in Journal of micromechanics and microengineering (01.03.2011)
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Journal Article
ADVANCED HANDLER WAFER DEBONDING METHOD
ANDRY PAUL S, KNICKERBOCKER JOHN U, TRZCINSKI ROBERT E, BUDD RUSSELL A, LA TULIPE JR. DOUGLAS C
Year of Publication 10.06.2015
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Year of Publication 10.06.2015
Patent
Three-dimensional silicon integration
Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
Doany, Fuad E, Lee, Benjamin G, Schow, Clint L, Tsang, Cornelia K, Baks, Christian, Kwark, Young, John, Richard, Knickerbocker, John U, Kash, Jeffrey A
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD
ANDRY PAUL S, KNICKERBOCKER JOHN U, KATOPSIS GEORGE A, TSAPEPAS STELIOS G, WEBB BUCKNELL C, BUCHWALTER STEPHEN L
Year of Publication 08.11.2010
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Year of Publication 08.11.2010
Patent
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Sakuma, K, Andry, P S, Tsang, C K, Wright, S L, Dang, B, Patel, C S, Webb, B C, Maria, J, Sprogis, E J, Kang, S K, Polastre, R J, Horton, R R, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Thermomechanical modeling of 3D electronic packages
Sri-Jayantha, S M, McVicker, G, Bernstein, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Journal Article
3D chip stacking with C4 technology
Dang, B, Wright, S L, Andry, P S, Sprogis, E J, Tsang, C K, Interrante, M J, Webb, B C, Polastre, R J, Horton, R R, Patel, C S, Sharma, A, Zheng, J, Sakuma, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
24-channel optical transceiver module for waveguide-on-card interconnects
Kash, Jeffrey A, Schow, Clint L, Doany, Fuad E, Lee, Benjamin G, Tsang, Cornelia K, Baks, Christian, Young Kwark, Knickerbocker, John U
Published in 2010 Conference on Optical Fiber Communication (OFC/NFOEC), collocated National Fiber Optic Engineers Conference (01.03.2010)
Published in 2010 Conference on Optical Fiber Communication (OFC/NFOEC), collocated National Fiber Optic Engineers Conference (01.03.2010)
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Conference Proceeding
Next generation computing systems with heterogeneous packaging integration
Knickerbocker, John U.
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)
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Conference Proceeding