Electrochemical reliability of NTV sintered flexible substrates
Klengel, Robert, Klengel, Sandy, Klute, Carola, Muhs-Portius, Bolko
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
METHOD OF ENHANCING THE STRENGTH OF SEMICONDUCTOR WAFERS OR CHIPS
SCHOENFELDER, STEPHAN, BAGDAHN, JOERG, BOHNE, ALEXANDER, KLUTE, CAROLA
Year of Publication 26.10.2011
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Year of Publication 26.10.2011
Patent