Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices
Ghannam, Ayad, van Haare, Niek, Bravin, Julian, Brandl, Elisabeth, Brandstatter, Birgit, Klingler, Hannes, Auer, Benedikt, Meunier, Philippe, Kersjes, Sebastiaan
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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