BMD impact on silicon fin defect at TSV bottom
Zhang, Dingyou, Thangaraju, Sarasvathi, Smith, Daniel, Kamineni, Himani, Klewer, Christian, Scholefield, Mark, Lei, Ming, Vikram, Abhishek, Lim, Victor, Kim, Wonwoo, Alapati, Ramakanth
Published in Electronics letters (19.06.2014)
Published in Electronics letters (19.06.2014)
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Journal Article
Chip Package Interaction (CPI) risk assessment of 22FDX® Wafer Level Chip Scale Package (WLCSP) using 2D Finite Element Analysis modeling
Machani, Kashi Vishwanath, Kuechenmeister, Frank, Breuer, Dirk, Klewer, Christian, Cho, Jae Kyu, Young-Fisher, Kristina
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding