Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages
Klengel, Sandy, Klengel, Robert, Stephan, Tino
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
Material characterization of copper structures for electronic systems manufactured by selective laser melting (SLM)
Klengel, Sandy, Krombholz, Andreas, Schwedler, Olaf, Busch, Hendrik
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Silver Bonding Wire - An Alternative for Mechanical Sensitive Chip Configurations in Automotive Electronics Packaging
Klengel, Robert, Klengel, Sandy, Tismer, Sebastian, Araki, Noritoshi, Eto, Motoki, Haibara, Teruo, Yamada, Takashi, Feldmann, Jochen, Scheer, Achim, Binner, Ralph, Peters, Henk
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
A new method for local electrochemical measurements at PCBs
Klengel, Sandy, Klengel, Robert, Stephan, Tino, Muhs-Portius, Bolko, Wilke, Dorit, Hahn, Michael
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Corrosion effects and reliability improvement of silver wire bonded contacts in automotive application
Klengel, Robert, Klengel, Sandy, Schischka, Jan, Araki, Noritoshi, Eto, Motoki, Haibara, Teruo, Yamada, Takashi
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Electrochemical reliability of NTV sintered flexible substrates
Klengel, Robert, Klengel, Sandy, Klute, Carola, Muhs-Portius, Bolko
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Influence of copper wire material to corrosion resistant packages and systems for high temperature applications
Klengel, Sandy, Klengel, Robert, Schischka, Jan, Stephan, Tino, Petzold, Matthias, Eto, Motoki, Araki, Noritoshi, Yamada, Takashi
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
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Conference Proceeding
A New Reliable, Corrosion Resistant Gold-Palladium Coated Copper Wire Material
Klengel, Sandy, Klengel, Robert, Schischka, Jan, Stephan, Tino, Petzold, Matthias, Eto, Motoki, Araki, Noritoshi, Yamada, Takashi
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
How Copper Wire Material Additive Elements Effect the Reliability of Wire Bonded Contacts in HAST testing
Klengel, Robert, Klengel, Sandy, Petzold, Matthias, Eto, Motoki, Araki, Noritoshi, Yamada, Takashi
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
A new method for prediction of corrosion processes in Aluminum housing materials for electronic components
Klengel, Sandy, Stephan, Tino, Muhs-Portius, Bolko
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
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Conference Proceeding
Corrosion mechanism in metallization systems for printed circuit boards
Klengel, Sandy, Stephan, Tino, Muhs-Portius, Bolko, Klengel, Robert
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Comprehensive Study of Long-Term Reliability of Copper Bonding Wires at Harsh Automotive Conditions
Klengel, Robert, Klengel, Sandy, Tismer, Sebastian, Ackermann, Thomas, Araki, Noritoshi, Eto, Motoki, Haibara, Teruo, Yamada, Takashi, Feldmann, Jochen, Binner, Ralph, Peters, Henk, Scheer, Achim, Chee, Vincent
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
The influence of environmental conditions on the properties of housing materials for power electronics
Bottge, Bianca, Bernhardt, Rico, Klengel, Sandy, Wels, Sebastian, Claudi, Albert
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
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Conference Proceeding
Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts
Klengel, Robert, Klengel, Sandy, Schischka, Jan, Stephan, Tino, Petzold, Matthias, Eto, Motoki, Araki, Noritoshi, Yamada, Takashi
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Microstructural and chemical investigation of dielectric breakdown areas in engineering plastics
Bernhardt, Rico, Böttge, Bianca, Klengel, Sandy, Bron, Michael, Wels, Sebastian, Claudi, Albert
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Limitation of test sample arrangements according to IEC 60243-1: Electrical strength of insulating materials - Test methods
Wels, Sebastian, Obst, Jens, Claudi, Albert, Bottge, Bianca, Bernhardt, Rico, Klengel, Sandy
Published in 2018 IEEE 2nd International Conference on Dielectrics (ICD) (01.07.2018)
Published in 2018 IEEE 2nd International Conference on Dielectrics (ICD) (01.07.2018)
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Conference Proceeding
Improvement of nickel wire bonding using Al nano coating
Klengel, Robert, Klengel, Sandy, Schischka, Jan, Lorenz, Georg, Petzold, Matthias
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
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Conference Proceeding