Interfacial reactions between lead-free solders and common base materials
Laurila, T., Vuorinen, V., Kivilahti, J.K.
Published in Materials science & engineering. R, Reports : a review journal (24.03.2005)
Published in Materials science & engineering. R, Reports : a review journal (24.03.2005)
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Journal Article
Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations
Vuorinen, V., Yu, H., Laurila, T., Kivilahti, J.K.
Published in Journal of electronic materials (01.06.2008)
Published in Journal of electronic materials (01.06.2008)
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Journal Article
Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
Lee, T. Y., Choi, W. J., Tu, K. N., Jang, J. W., Kuo, S. M., Lin, J. K., Frear, D. R., Zeng, K., Kivilahti, J. K.
Published in Journal of materials research (01.02.2002)
Published in Journal of materials research (01.02.2002)
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Journal Article
Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections
Mattila, T.T., Vuorinen, V., Kivilahti, J.K.
Published in Journal of materials research (01.11.2004)
Published in Journal of materials research (01.11.2004)
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Journal Article
Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes
Vuorinen, V., Laurila, T., Yu, H., Kivilahti, J. K.
Published in Journal of applied physics (15.01.2006)
Published in Journal of applied physics (15.01.2006)
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Journal Article
Simulation of dynamic recrystallization in solder interconnections during thermal cycling
Li, J., Xu, H., Mattila, T.T., Kivilahti, J.K., Laurila, T., Paulasto-Kröckel, M.
Published in Computational materials science (01.12.2010)
Published in Computational materials science (01.12.2010)
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Journal Article
Reactive sputter deposition and properties of TaxN thin films
RIEKKINEN, T, MOLARIUS, J, LAURILA, T, NURMELA, A, SUNI, I, KIVILAHTI, J. K
Published in Microelectronic engineering (01.10.2002)
Published in Microelectronic engineering (01.10.2002)
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Conference Proceeding
Journal Article
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
Laurila, T., Mattila, T., Vuorinen, V., Karppinen, J., Li, J., Sippola, M., Kivilahti, J.K.
Published in Microelectronics and reliability (01.07.2007)
Published in Microelectronics and reliability (01.07.2007)
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Journal Article
Wetting reaction versus solid state aging of eutectic SnPb on Cu
Tu, K. N., Lee, T. Y., Jang, J. W., Li, L., Frear, D. R., Zeng, K., Kivilahti, J. K.
Published in Journal of applied physics (01.05.2001)
Published in Journal of applied physics (01.05.2001)
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Journal Article