High-density and high-pin count flexible SMD connector for high-speed data bus
Sasaki, S., Kishimoto, T.
Published in Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium : electronics manufacturing for the year 2000 : October 4-6, 1993, Santa Clara, CA, USA (1993)
Published in Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium : electronics manufacturing for the year 2000 : October 4-6, 1993, Santa Clara, CA, USA (1993)
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Conference Proceeding
Journal Article
VLSI Packaging Technique Using Liquid-Cooled Channels
Kishimoto, T., Ohsaki, T.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1986)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1986)
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Journal Article
Multichip module technologies for high-speed ATM switching systems
Sasaki, S., Kishimoto, T., Genda, K., Endo, K., Kaizu, K.
Published in Proceedings of the International Conference on Multichip Modules (1994)
Published in Proceedings of the International Conference on Multichip Modules (1994)
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Conference Proceeding
Air Cooling Of Mcms Mounted On Card-on- Board Packaging Systems
Harada, A., Kaneko, Y., Kishimoto, T.
Published in Proceedings of Japan International Electronic Manufacturing Technology Symposium (1993)
Published in Proceedings of Japan International Electronic Manufacturing Technology Symposium (1993)
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Conference Proceeding
Heat-Pipe Cooling Technology for High-Speed Atm Switching Mcms
Kishimoto, T., Sasaki, S., Genda, K., Endo, K., Kaizu, K.
Published in Proceedings of the International Conference on Multichip Modules (1994)
Published in Proceedings of the International Conference on Multichip Modules (1994)
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Conference Proceeding
320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM
Yamanaka, N., Ken-ichi Endo, Genda, K., Fukuda, H., Kishimoto, T., Shin-ichi Sasaki
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1995)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1995)
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Journal Article
Conference Proceeding
Coaxial SMT module connector for high-speed MCM
Sasaki, S., Kishimoto, T., Sugiura, N.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Gas Cooling Enhancement Technology for Integrated Circuit Chips
Kishimoto, T., Sasaki, E., Moriya, K.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.09.1984)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.09.1984)
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Journal Article
An ATM switch hardware technologies using multichip packaging
Doi, Y., Yamada, H., Sasaki, S., Kishimoto, T., Tomimuro, H.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)
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Journal Article
Conference Proceeding