PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH ADHESIVE TAPE, LEAD FRAME WITH ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING LEAD FRAME
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Year of Publication 07.11.2003
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Year of Publication 07.11.2003
Patent
PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
HOSOKAWA, YOUICHI, NOMURA, YOSHIHIRO, IIOKA, SHINJI, YANAGISAWA, SATORU, TANABE, YOSHIYUKI, KIRIHARA, HIROSHI
Year of Publication 28.01.1999
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Year of Publication 28.01.1999
Patent
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, METHODS OF MANUFACTURING THE DEVICE AND SUBSTRATE, ADHESIVE, AND ADHESIVE DOUBLE COATED FILM
YAMAMOTO, KAZUNORI, KURIYA, HIROYUKI, TOMIYAMA, TAKEO, KANEDA, AIZOU, NOMURA, YOSHIHIRO, SHIMADA, YASUSHI, KAGEYAMA, AKIRA, KUMASHIRO, YASUSHI, INADA, TEIICHI, HOSOKAWA, YOICHI, KIRIHARA, HIROSHI
Year of Publication 16.04.1998
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Year of Publication 16.04.1998
Patent