by Kiran, Shiva, Shengchang Cai, Ying Luo, Hoyos, Sebastian, Palermo, Samuel
Published in IEEE journal of solid-state circuits (01.03.2019)

by Zhu, Yuanming, Liu, Tong, Kaile, Srujan Kumar, Kiran, Shiva, Yi, Il-Min, Liu, Ruida, Diaz, Julian Camilo Gomez, Hoyos, Sebastian, Palermo, Samuel
Published in IEEE journal of solid-state circuits (01.08.2023)

by Shengchang Cai, Tabasy, Ehsan Zhian, Shafik, Ayman, Kiran, Shiva, Hoyos, Sebastian, Palermo, Samuel
Published in IEEE journal of solid-state circuits (01.08.2017)

by Khairi, Ahmad, Krupnik, Yoel, Laufer, Amir, Segal, Yoav, Cusmai, Marco, Levin, Itamar, Gordon, Ari, Sabag, Yaniv, Rahinski, Vitali, Lotan, Idan, Ori, Gadi, Familia, Noam, Litski, Stas, Grafi, Tali Warshavsky, Virobnik, Udi, Lazar, Dror, Horwitz, Yeshayahu, Balankutty, Ajay, Kiran, Shiva, Palermo, Samuel, Li, Peng Mike, O'Mahony, Frank, Cohen, Ariel
Published in IEEE journal of solid-state circuits (01.01.2023)

by Kiran, Shiva, Shafik, Ayman, Tabasy, Ehsan Zhian, Cai, Shengchang, Lee, Keytaek, Hoyos, Sebastian, Palermo, Samuel
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2019)

by Palermo, Samuel, Hoyos, Sebastian, Cai, Shengchang, Kiran, Shiva, Zhu, Yuanming
Published in IEEE solid state circuits magazine (01.01.2018)

by Zhu, Yuanming, Cai, Shengchang, Shiva Kiran, Yang-Hang, Fan, Chang, Po-Hsuan, Hoyos, Sebastian, Palermo, Samuel
Published in arXiv.org (20.08.2022)

by Babu, G. Srinu, Kiran, R. R. Shiva, Lokeswari, N., Raju, K. Jaya
Published in E-journal of chemistry (01.01.2007)

by M, Kishor, Ghuliani, Deepak, Neogi, Sushanto, Addu, Shiva Kiran, Singh, Abhinav
Published in Curēus (Palo Alto, CA) (29.06.2024)

by Kiran, Shiva, Cai, Shengchang, Luo, Ying, Hoyos, Sebastian, Palermo, Samuel
Published in 2018 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2018)

by Kiran, Shiva, Cai, Shengchang, Luo, Ying, Hoyos, Sebastian, Palermo, Samuel
Published in 2019 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2019)

by Zhu, Yuanming, Cai, Shengchang, Kiran, Shiva, Fan, Yang-Hang, Chang, Po-Hsuan, Hoyos, Sebastian, Palermo, Samuel
Published in 2020 IEEE Custom Integrated Circuits Conference (CICC) (01.03.2020)

by Zhu, Yuanming, Liu, Tong, Kaile, Srujan Kumar, Kiran, Shiva, Yi, II-Min, Liu, Ruida, Gomez Diaz, Julian Camilo, Hoyos, Sebastian, Palermo, Samuel
Published in 2022 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2022)

by Gomez Diaz, Julian Camilo, Kiran, Shiva, Palermo, Samuel, Hoyos, Sebastian
Published in 2019 IEEE 62nd International Midwest Symposium on Circuits and Systems (MWSCAS) (01.08.2019)

by Segal, Yoav, Laufer, Amir, Khairi, Ahmad, Krupnik, Yoel, Cusmai, Marco, Levin, Itamar, Gordon, Ari, Sabag, Yaniv, Rahinski, Vitali, Ori, Gadi, Familia, Noam, Litski, Stas, Warshavsky, Tali, Virobnik, Udi, Horwitz, Yeshayahu, Balankutty, Ajay, Kiran, Shiva, Palermo, Samuel, Li, Peng Mike, Cohen, Ariel
Published in 2022 IEEE International Solid- State Circuits Conference (ISSCC) (20.02.2022)

by Kumar, Rajendra, Manjunath, Rudrappa, Sudha, Kiran, Shiva, Srinivas, V.Y
Published in Journal of evolution of medical and dental sciences (04.09.2014)

by Reddy, P.Srinivas, Nishwa, T., Reddy, R. Shiva Kiran, Sadviq, Ch, Rithvik, K.
Published in 2021 6th International Conference on Communication and Electronics Systems (ICCES) (08.07.2021)

by K. Poojith, B. Divya, M. Nikhil, E. Shiva Kiran, A. Ramesh
Published in International Journal of Advanced Research in Science, Communication and Technology (09.04.2022)

by Kiran, Shiva, Cai, Shengchang, Hoyos, Sebastian, Palermo, Samuel
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)

by Kiran, Shiva, Balankutty, Ajay, Liu, Yutao, Dokania, Rajeev, Venkataraman, Hariprasath, Wali, Priya, Kim, Stephen, Krupnik, Yoel, Cohen, Ariel, O'Mahony, Frank
Published in 2021 Symposium on VLSI Circuits (13.06.2021)