Strength characterization of TEOS and FTEOS interlayer dielectric materials to compare fracture risk in die stack by 3D FE simulation approach
Lakhera, Nishant, Howell, Jim, Kipperman, Scott, Welsh, Evan, Schmadlak, Ilko
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
Published in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2017)
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