Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories
Lehman, L.P., Kinyanjui, R.K., Zavalij, L., Zribi, A., Cotts, E.J.
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints
Lehman, L.P., Kinyanjui, R.K., Wang, J., Xing, Y., Zavalij, L., Borgesen, P., Cotts, E.J.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate
Kinyanjui, R.K., Zribi, A., Cotts, E.J.
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding