Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu Near Eutectic Alloys
Kinyanjui, R., Lehman, L.P., Zavalij, L., Cotts, E.
Published in Journal of materials research (01.11.2005)
Published in Journal of materials research (01.11.2005)
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Journal Article
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
LEHMAN, L. P, ATHAVALE, S. N, XING, Y, ZAVALIJ, L, BORGESEN, P, COTTS, E. J, FULLEM, T. Z, GIAMIS, A. C, KINYANJUI, R. K, LOWENSTEIN, M, MATHER, K, PATEL, R, RAE, D, WANG, J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Conference Proceeding
Journal Article
Late Quaternary vegetation and fire dynamics on Mount Kenya
Rucina, Stephen M., Muiruri, Veronica M., Kinyanjui, Rahab N., McGuiness, Katy, Marchant, Rob
Published in Palaeogeography, palaeoclimatology, palaeoecology (01.12.2009)
Published in Palaeogeography, palaeoclimatology, palaeoecology (01.12.2009)
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Journal Article
Campath, calcineurin inhibitor reduction and chronic allograft nephropathy (3C) study: background, rationale, and study protocol
Haynes, Richard, Baigent, Colin, Harden, Paul, Landray, Martin, Akyol, Murat, Asderakis, Argiris, Baxter, Alex, Bhandari, Sunil, Chowdhury, Paramit, Clancy, Marc, Emberson, Jonathan, Gibbs, Paul, Hammad, Abdul, Herrington, Will, Jayne, Kathy, Jones, Gareth, Krishnan, Nithya, Lay, Michael, Lewis, David, Macdougall, Iain, Nathan, Chidambaram, Neuberger, James, Newstead, Chas, Pararajasingam, Ravi, Puliatti, Carmelo, Rigg, Keith, Rowe, Peter, Sharif, Adnan, Sheerin, Neil, Sinha, Sanjay, Watson, Chris, Friend, Peter
Published in Transplantation research (06.05.2013)
Published in Transplantation research (06.05.2013)
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Journal Article
Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints
Lehman, L.P., Kinyanjui, R.K., Wang, J., Xing, Y., Zavalij, L., Borgesen, P., Cotts, E.J.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Cytomegalovirus glycoprotein-B vaccine with MF59 adjuvant in transplant recipients: a phase 2 randomised placebo-controlled trial
Griffiths, Paul D, Prof, Stanton, Anna, RN, McCarrell, Erin, MSc, Smith, Colette, PhD, Osman, Mohamed, PhD, Harber, Mark, FRCP, Davenport, Andrew, FRCP, Jones, Gareth, MRCP, Wheeler, David C, FRCP, O'Beirne, James, MRCP, Thorburn, Douglas, FRCP, Patch, David, FRCP, Atkinson, Claire E, MSc, Pichon, Sylvie, MSc, Sweny, Paul, FRCP, Lanzman, Marisa, MRPharmS, Woodford, Elizabeth, Rothwell, Emily, RGN, Old, Natasha, BA, Kinyanjui, Ruth, RN, Haque, Tanzina, FRCPath, Atabani, Sowsan, MRCPath, Luck, Suzanne, MBChB, Prideaux, Steven, BSc, Milne, Richard SB, PhD, Emery, Vincent C, Prof, Burroughs, Andrew K, Prof
Published in The Lancet (British edition) (09.04.2011)
Published in The Lancet (British edition) (09.04.2011)
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Journal Article
Thermal cycling reliability, microstructural characterization, and assembly challenges with backward compatible soldering of a large, high density ball grid array
Vasudevan, V., Coyle, R., Aspandiar, R., Tisdale, S., Kinyanjui, R., Long, G.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories
Lehman, L.P., Kinyanjui, R.K., Zavalij, L., Zribi, A., Cotts, E.J.
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate
Kinyanjui, R.K., Zribi, A., Cotts, E.J.
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding