Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations
Kim, Seoah, Kim, YehRi, Jo, Eunjin, Lee, Hyeon-Sung, Mhin, Sungwook, Lee, Tae-Young, Yoo, Sehoon, Ko, Yong-Ho, Kim, Dongjin
Published in Journal of materials research and technology (01.05.2024)
Published in Journal of materials research and technology (01.05.2024)
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Journal Article
Temperature and thickness-dependent silver hillock generation mechanism and surface morphology nature of direct plated silver layers onto copper substrates
Kim, YehRi, Kim, Seoah, Zhang, Zheng, Chen, Chuantong, Suganuma, Katsuaki, Ju, Byeong Kwon, Kim, Dongjin
Published in Journal of alloys and compounds (30.08.2024)
Published in Journal of alloys and compounds (30.08.2024)
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Journal Article
Solid-State Bonding with SAC305 Sheets for Direct Cooling
Jo, Eunjin, Kim, YehRi, Park, Young-Bae, Kim, Dongjin
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding
Thermo-Mechanical Reliability of Ag Porous Sheet Bonding Structures
Kim, Dongjin, Kim, YehRi, Jo, Eunjin, Kim, Seoah, Park, Jiyong, Ko, Yong-Ho
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding
Bonding Parameter-Dependent Microstructural and Mechanical Capabilities of Ag Porous Sheet Bonding
Kim, YehRi, Jo, Eunjin, Ju, Byeong Kwon, Lee, Yoongul, Kim, Jaeup, Ahn, Kijoon, Kim, Dongjin
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding