Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers
Jeong, Min Seong, Park, Sang Woo, Kim, Yeon Ju, Kim, Ji Hun, Hong, Seul Ki, Kim, Sarah Eunkyung, Park, Jong Kyung
Published in Scientific reports (20.03.2024)
Published in Scientific reports (20.03.2024)
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Journal Article
Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects
Park, Haesung, Seo, Hankyeol, Kim, Sarah Eunkyung
Published in Electronic materials letters (01.09.2021)
Published in Electronic materials letters (01.09.2021)
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Journal Article
Exploring the intellectual structure of nanoscience and nanotechnology: journal citation network analysis
Jo, Haejin, Park, Yongtae, Kim, Sarah Eunkyung, Lee, Hakyeon
Published in Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology (01.06.2016)
Published in Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology (01.06.2016)
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Journal Article
Thermal assessment of copper through silicon via in 3D IC
Shin, Younhwan, Kim, Sarah Eunkyung, Kim, Sungdong
Published in Microelectronic engineering (20.04.2016)
Published in Microelectronic engineering (20.04.2016)
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Journal Article
Copper Bonding Technology in Heterogeneous Integration
Lee, Yoon-Gu, McInerney, Michael, Joo, Young-Chang, Choi, In-Suk, Kim, Sarah Eunkyung
Published in Electronic materials letters (2024)
Published in Electronic materials letters (2024)
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Journal Article
Effects of forming gas plasma treatment on low-temperature Cu-Cu direct bonding
Kim, Sungdong, Nam, Youngju, Kim, Sarah Eunkyung
Published in Japanese Journal of Applied Physics (01.06.2016)
Published in Japanese Journal of Applied Physics (01.06.2016)
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Journal Article
Wafer warpage analysis of stacked wafers for 3D integration
Kim, Youngrae, Kang, Sung-Keun, Kim, Sung-Dong, Kim, Sarah Eunkyung
Published in Microelectronic engineering (2012)
Published in Microelectronic engineering (2012)
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Journal Article
Conference Proceeding
Dynamic flow measurements of capillary underfill through a bump array in flip chip package
Lee, Seok Hwan, Sung, Jaeyong, Kim, Sarah Eunkyung
Published in Microelectronics and reliability (01.12.2010)
Published in Microelectronics and reliability (01.12.2010)
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Journal Article
Characterization of flip chip bonded structure with Cu ABL power bumps
Ma, Junsung, Kim, Sungdong, Kim, Sarah Eunkyung
Published in Microelectronics and reliability (01.08.2014)
Published in Microelectronics and reliability (01.08.2014)
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Journal Article