공정시간 및 온도에 따른 웨이퍼레벨 패키지 접합 최적설계에 관한 연구
고현준, 임승용, 김희태, 김종형, 김옥래, Ko, Hyun-Jun, Lim, Seung-Yong, Kim, Hee-Tea, Kim, Jong-Hyeong, Kim, Ok-Rae
Published in 한국생산제조시스템학회지 (2014)
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Published in 한국생산제조시스템학회지 (2014)
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Wafer Level Package Design Optimization Using FEM
Ko, Hyun-Jun, Lim, Seung-Yong, Kim, Hee-Tea, Kim, Jong-Hyeong, Kim, Ok-Rae
Published in Journal of the Korean Society of Manufacturing Technology Engineers (15.06.2014)
Published in Journal of the Korean Society of Manufacturing Technology Engineers (15.06.2014)
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KIM, JONG DUK, KIM, YOUNG KEUN, JANG, GI SOO, LEE, SANG YONG, KIM, OK RAE, KWAK, KYEONG MIN, KWON, CHANG OH
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Molding method and mold for improving bonding properties of metal and plastic composites
HA SEOK JAE, JANG JUN YOUNG, KIM OK RAE, SON MIN KYU, YOUNG BAE KO, CHA BAEG SOON, SEO KEUM HEE
Year of Publication 10.12.2019
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Year of Publication 10.12.2019
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FRAGMENTAL TYPE PROCESSING DEVICE FOR MOLD
KO, HYUN JUN, PARK, GYUN MYOUNG, LEE, SANG CHUL, KIM, SUNG GYU, KIM, OK RAE
Year of Publication 05.03.2012
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Year of Publication 05.03.2012
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PROCESSING DEVICE USING DEGREE OF FREEDOM
KO, HYUN JUN, PARK, GYUN MYOUNG, KIM, SUNG GYU, LEE, SANG YONG, KIM, OK RAE
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Year of Publication 19.07.2011
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REPLACEMENT APPARATUS OF RAPPING TOOL FOR MOLD
KO, HYUN JUN, PARK, GYUN MYOUNG, KIM, SUNG GYU, LEE, SANG CHUL, LEE, SANG YONG, KIM, OK RAE
Year of Publication 17.05.2011
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Year of Publication 17.05.2011
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