The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn–3.5Ag solders on Cu substrates in fluxless soldering
Lee, Jeong Hwan, Ma, Sung Woo, Kim, Young Min, Lee, Jin Su, Kim, Ki Bum, Kim, Jae Myun, Oh, Jae Sung, Kim, Namseog, Kim, Young-Ho
Published in Journal of materials science. Materials in electronics (01.09.2013)
Published in Journal of materials science. Materials in electronics (01.09.2013)
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Journal Article
Current-assisted direct Cu/Cu joining
Shin, Chanho, Ma, Sung Woo, Lee, Jeong Hwan, Kim, Ki Bum, Suh, Minsuk, Kim, Namseog, Kim, Young-Ho
Published in Scripta materialia (15.07.2015)
Published in Scripta materialia (15.07.2015)
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Journal Article
Through-silicon via structures including conductive protective layers
Yoon, Minseung, Kim, Namseog, Kim, Pyoungwan, Ma, Keumhee, Jo, Chajea
Year of Publication 27.09.2011
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Year of Publication 27.09.2011
Patent
APPARATUS AND METHOD FOR PLATING A SUBSTRATE
KIM NAMSEOG, JU YOUNGHYUN, LEE UIHYOUNG, SEO WOONHO, HAN MIN-SUK, CHOI JU-IL
Year of Publication 12.05.2011
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Year of Publication 12.05.2011
Patent
Apparatus and method for plating a substrate
KIM NAMSEOG, JU YOUNGHYUN, LEE UIHYOUNG, SEO WOONHO, HAN MIN-SUK, CHOI JU-IL
Year of Publication 11.05.2011
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Year of Publication 11.05.2011
Patent