3DIC developments for high yield and reliability manufacturing
Chang, Jonathan, Liu, Henley, Myongseob Kim, Ramalingam, Suresh, Xin Wu
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)
Get full text
Conference Proceeding
Fast and sensitive electret polymer characterization by extended floating gate MOSFET
Kim, M., Shen, N.Y.-M., Lee, C., Kan, E.C.
Published in IEEE transactions on dielectrics and electrical insulation (01.10.2005)
Published in IEEE transactions on dielectrics and electrical insulation (01.10.2005)
Get full text
Journal Article
Outstanding and innovative reliability study of 3D TSV interposer and fine pitch solder micro-bumps
Banijamali, B., Ramalingam, S., Liu, H., Myongseob Kim
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Get full text
Conference Proceeding
Assembly process qualification and reliability evaluations for heterogeneous 2.5D FPGA with HiCTE Ceramic
Hariharan, Ganesh, Chaware, Raghunandan, Yip, Laurene, Singh, Inderjit, Ng, Kenny, Pai, S. Y., Myongseob Kim, Liu, Henley, Ramalingam, Suresh
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Get full text
Conference Proceeding
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
Kwon, Woon-Seong, Kim, Myongseob, Chang, Jonathan, Ramalingam, Suresh, Madden, Liam, Tsai, Genie, Tseng, Stephen, Lai, J.Y., Lu, Terren, Chiu, Steve
Published in Journal of microelectronics and electronic packaging (01.08.2015)
Published in Journal of microelectronics and electronic packaging (01.08.2015)
Get full text
Journal Article
METHOD OF TESTING A SEMICONDUCTOR STRUCTURE
CHANG CHEANG WHANG, PARAMESWARAN SURESH P, LIU HENLEY, GONG YUQING, KIM MYONGSEOB, ANG BOON Y
Year of Publication 08.06.2015
Get full text
Year of Publication 08.06.2015
Patent
Process and device characteristics of self-assembled metal nano-crystal EEPROM
Liu, Zengtao, Kim, Myongseob, Narayanan, Venkat, Kan, Edwin C.
Published in Superlattices and microstructures (01.11.2000)
Published in Superlattices and microstructures (01.11.2000)
Get full text
Journal Article
Performance Improvement for FPGA due to Interposer Metal Insulator Metal Decoupling Capacitors (MIMCAP)
Kim, Myongseob, Liu, Henley, Klokotov, Dima, Wong, Anna, To, Thomas, Chang, Jonathan
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Get full text
Conference Proceeding
Novel electrostatic repulsion forces in MEMS applications by nonvolatile charge injection
Zengtao Liu, Myongseob Kim, Shen, N., Kan, E.C.
Published in Proceedings, IEEE micro electro mechanical systems (2002)
Published in Proceedings, IEEE micro electro mechanical systems (2002)
Get full text
Conference Proceeding
Actuation by electrostatic repulsion by nonvolatile charge injection
Liu, Zengtao, Kim, Myongseob, Shen, Nick Yu-Min, Kan, Edwin C.
Published in Sensors and actuators. A. Physical. (28.03.2005)
Published in Sensors and actuators. A. Physical. (28.03.2005)
Get full text
Journal Article