Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
Se-Ho You, Seonghwan Jeon, Dan Oh, Kilsoo Kim, Jaechoon Kim, Seung-Yong Cha, GyoungBum Kim
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Cost Effective 2.3D Packaging Solution by using Fanout Panel Level RDL
Kim, Joonsung, Choi, Jaehoon, Kim, Sanguk, Choi, Jooyoung, Park, Yongjin, Kim, Gyoungbum, Kim, Sangyu, Park, Sangwook, Oh, Hwasub, Lee, Seok Won, Cho, Taeje, Kim, Dong Wook
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
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Conference Proceeding
Solving Power Integrity Challenges for Smart Computing Era
Lee, Manho, Song, Eunseok, Kim, Gyoungbum, Oh, Dan Kyung Suk
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Chip/Package Co-Design Analysis of Advanced D2D Interface Using a Statistical Link Simulator
Park, Sangwook, An, Heewoo, Jeon, Seonghwan, Kim, Gyoungbum, Oh, Dan Kyung Suk
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Power Integrity Performance Gain of a Novel Integrated Stack Capacitor (ISC) Solution for High-end Computing Applications
Song, Eunseok, Oh, Dan Kyung Suk, Cha, Seung-Yong, Jang, Jaejune, Hwang, Taejoo, Kim, Gyoungbum, Kim, Jongkook, Min, Sunghwan, Kim, Kilsoo, Kim, Dae-Woo, Yoon, Seungwook
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Optimization of High-Speed Package Design on Statistical Domain
Kim, Il-Joon, Lee, Manho, Han, Ki Jin, Kim, Gyoungbum, Kim, Dae-Woo, Oh, Dan
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Construction of an RF-band test fixture model using 3-D field simulator
Kim, KiHyuk, Kim, GyoungBum, Cha, Seung Yong, Hwang, SungWoo
Published in Microwave and optical technology letters (01.03.2006)
Published in Microwave and optical technology letters (01.03.2006)
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Journal Article