by Kim, Byongjin, Lee, Euehun
Published in Inquiry (Chicago) (01.01.2022)

by Kim, ByongJin, Jeon, HyeongIl, Park, DaeYoung, Kim, GiJeong, Cho, Nam-Hee, Khim, JinYoung
Published in Journal of advanced joining processes (01.06.2022)

by KIM BYONGJIN
Year of Publication 02.12.2020

by Kim, Byongjin, Lee, Euehun, Jo, Sang Hyun
Published in Informatics for health & social care (03.04.2023)

by Kim, ByongJin, Jeon, HyeongIl, Kim, GiJeong, Bang, WonBae, Khim, JinYoung
Published in Microelectronics international (17.03.2023)

by KIM BYONGJIN, LEE SEUNGRYOUNG, YOO JONGUK, KIM JONGMOON
Year of Publication 22.05.2020

by KIM BYONGJIN, YOO JONGUK, LEE SEUNGYOUNG, KIM JONGMOON
Year of Publication 08.05.2020

by HoJeong Lim, JeongKyu Yang, HeeYeon Ku, ChongGeun Ahn, TaeYong Lee, ByongJin Kim, JiYong Chung
Published in 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) (01.05.2016)

by Kim, ByongJin, Bolotnikov, Alexander, Jeong, Helen, Kim, Chandong, Das, Hrishkesh, Ponram, Ganesh
Published in 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (07.03.2023)

by Park, DaeYoung, Jeon, HyeongIl, Kim, GiJeong, Yang, JiYeon, Sang, KwangSoo, Kim, ByongJin, Khim, JinYoung
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)