RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR CHIP HAVING RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP HAVING RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
IHARA, Katsutoshi, SUGIYAMA, Genki, TAKANO, Kentaro, KAMEI, Takayuki, KIDA, Tsuyoshi
Year of Publication 20.04.2023
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Year of Publication 20.04.2023
Patent
RESIN COMPOSITION, LAYERED PRODUCT, SEMICONDUCTOR CHIP WITH RESIN COMPOSITION LAYER, SUBSTRATE ON WHICH SEMICONDUCTOR CHIP WITH RESIN COMPOSITION LAYER IS TO BE MOUNTED, AND SEMICONDUCTOR DEVICE
IHARA, Katsutoshi, SUGIYAMA, Genki, TAKANO, Kentaro, KAMEI, Takayuki, KIDA, Tsuyoshi
Year of Publication 20.04.2023
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Year of Publication 20.04.2023
Patent
FILM UNDERFILL MATERIAL, RESIN COMPOSITION FOR FILM UNDERFILL MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP WITH RESIN COMPOSITION LAYER USING FILM UNDERFILL MATERIAL, METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP WITH RESIN COMPOSITION LAYER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
IHARA, Katsutoshi, SUGIYAMA, Genki, TAKANO, Kentaro, KAMEI, Takayuki, KIDA, Tsuyoshi
Year of Publication 20.04.2023
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Year of Publication 20.04.2023
Patent
The Reduction of Outgas from Pre-Applied Underfill Materials by Optimizing the Combination of Base Resin and Flux Compound
Higashiguchi, Kohei, Takiguchi, Takenori, Okaniwa, Masashi, Ihara, Katsutoshi, Kida, Tsuyoshi, Yoshida, Shu, Oshima, Toyoji
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Éditorial
Parepa, Laura-Anca, Kida, Tsuyoshi
Published in Travaux interdisciplinaires du Laboratorie parole et langage d'Aix-en-Provence (11.05.2017)
Published in Travaux interdisciplinaires du Laboratorie parole et langage d'Aix-en-Provence (11.05.2017)
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Journal Article
필름, 적층체, 필름층 부착 반도체 웨이퍼, 필름층 부착 반도체 탑재용 기판, 및 반도체 장치
OKANIWA MASASHI, SUGIYAMA GENKI, SEKIDO TAKAHITO, KIDA TSUYOSHI, TAKANO KENTARO
Year of Publication 11.03.2022
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Year of Publication 11.03.2022
Patent
필름, 적층체, 필름층이 형성된 반도체 웨이퍼, 필름층이 형성된 반도체 탑재용 기판, 및 반도체 장치
HIGASHIGUCHI KOHEI, OKANIWA MASASHI, SEKIDO TAKAHITO, KIDA TSUYOSHI, TAKANO KENTARO
Year of Publication 11.03.2022
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Year of Publication 11.03.2022
Patent
필름, 적층체, 필름층이 형성된 반도체 웨이퍼, 필름층이 형성된 반도체 탑재용 기판, 및 반도체 장치
HIGASHIGUCHI KOHEI, OKANIWA MASASHI, SEKIDO TAKAHITO, KIDA TSUYOSHI, TAKANO KENTARO
Year of Publication 11.03.2022
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Year of Publication 11.03.2022
Patent
Éditorial: Conflit en discours et discours en conflit
Kida, Tsuyoshi, Parepa, Laura-Anca
Published in Travaux interdisciplinaires du Laboratorie parole et langage d'Aix-en-Provence (20.12.2016)
Published in Travaux interdisciplinaires du Laboratorie parole et langage d'Aix-en-Provence (20.12.2016)
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Journal Article
Éditorial
Kida, Tsuyoshi, Parepa, Laura-Anca
Published in Travaux interdisciplinaires du Laboratorie parole et langage d'Aix-en-Provence (20.12.2016)
Published in Travaux interdisciplinaires du Laboratorie parole et langage d'Aix-en-Provence (20.12.2016)
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Journal Article
Novel Pre-Applied Underfill Material Designed for Collective Bonding Process
Okaniwa, Masashi, Higashiguchi, Kohei, Sekido, Takahito, Ihara, Katsutoshi, Kida, Tsuyoshi, Yoshida, Shu
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2020)
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Journal Article
수지 조성물, 적층체, 수지 조성물층이 형성된 반도체 웨이퍼, 수지 조성물층이 형성된 반도체 탑재용 기판, 및 반도체 장치
HIGASHIGUCHI KOHEI, OKANIWA MASASHI, KIDA TSUYOSHI, TAKIGUCHI TAKENORI
Year of Publication 13.01.2021
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Year of Publication 13.01.2021
Patent
수지 조성물, 적층체, 수지 조성물층이 부착된 반도체 웨이퍼, 수지 조성물층이 부착된 반도체 탑재용 기판, 및 반도체 장치
HIGASHIGUCHI KOHEI, OKANIWA MASASHI, KIDA TSUYOSHI, TAKIGUCHI TAKENORI
Year of Publication 13.01.2021
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Year of Publication 13.01.2021
Patent
수지 조성물, 적층체, 수지 조성물층이 형성된 반도체 웨이퍼, 수지 조성물층이 형성된 반도체 탑재용 기판, 및 반도체 장치
HIGASHIGUCHI KOHEI, OKANIWA MASASHI, KIDA TSUYOSHI, TAKIGUCHI TAKENORI
Year of Publication 08.01.2021
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Year of Publication 08.01.2021
Patent