High‐Temperature Oxidation‐Resistant Printed Copper Conductors
Khuje, Saurabh, Alshatnawi, Firas, Alhendi, Mohammed, Yu, Jian, Sheng, Aaron, Huang, Yulong, Zhuang, Cheng‐Gang, Armstrong, Jason, Zhou, Chi, Poliks, Mark, Ren, Shenqiang
Published in Advanced electronic materials (01.03.2023)
Published in Advanced electronic materials (01.03.2023)
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Journal Article
Flexible and printable dielectric polymer composite with tunable permittivity and thermal stability
Hu, Feng, An, Lu, Chivate, Aditya Tushar, Guo, Zipeng, Khuje, Saurabh Vishwas, Huang, Yulong, Hu, Yong, Armstrong, Jason, Zhou, Chi, Ren, Shenqiang
Published in Chemical communications (Cambridge, England) (20.02.2020)
Published in Chemical communications (Cambridge, England) (20.02.2020)
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Journal Article
Additive Manufacturing of High‐Temperature Preceramic‐Derived SiOC Hybrid Functional Ceramics
Li, Zheng, Khuje, Saurabh, Islam, Abdullah, Ren, Shenqiang
Published in Advanced engineering materials (01.11.2023)
Published in Advanced engineering materials (01.11.2023)
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Journal Article
Molecular copper decomposition ink for printable electronics
Sheng, Aaron, Islam, Abdullah, Khuje, Saurabh, Yu, Jian, Tsang, Harvey, Bujanda, Andres, Ren, Shenqiang
Published in Chemical communications (Cambridge, England) (23.08.2022)
Published in Chemical communications (Cambridge, England) (23.08.2022)
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Journal Article
Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals
Khuje, Saurabh, Alshatnawi, Firas, Smilgies, Detlef, Alhendi, Mohammed, Islam, Abdullah, Armstrong, Jason, Yu, Jian, Poliks, Mark, Ren, Shenqiang
Published in Advanced functional materials (01.01.2024)
Published in Advanced functional materials (01.01.2024)
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Journal Article
A 3D-printed molecular ferroelectric metamaterial
Hu, Yong, Guo, Zipeng, Ragonese, Andrew, Zhu, Taishan, Khuje, Saurabh, Li, Changning, Grossman, Jeffrey C., Zhou, Chi, Nouh, Mostafa, Ren, Shenqiang
Published in Proceedings of the National Academy of Sciences - PNAS (03.11.2020)
Published in Proceedings of the National Academy of Sciences - PNAS (03.11.2020)
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Journal Article
Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics
Sheng, Aaron, Khuje, Saurabh, Yu, Jian, Petit, Donald, Parker, Thomas, Zhuang, Cheng-Gang, Kester, Lanrik, Ren, Shenqiang
Published in Nano letters (10.11.2021)
Published in Nano letters (10.11.2021)
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Journal Article
High‐Temperature Copper–Graphene Conductors via Aerosol Jetting
Yu, Jian, Khuje, Saurabh, Sheng, Aaron, Kilczewski, Steven, Parker, Thomas, Ren, Shenqiang
Published in Advanced engineering materials (01.09.2022)
Published in Advanced engineering materials (01.09.2022)
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Journal Article
Copper-Coated E-Glass Fiber-Based Strain Sensors for High Temperatures
Khuje, Saurabh, Zhu, Long, Yu, Jian, Ren, Shenqiang
Published in ACS applied electronic materials (07.11.2024)
Published in ACS applied electronic materials (07.11.2024)
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Journal Article
Smart Metallized Textiles with Emissivity Tuning
Khuje, Saurabh, Islam, Abdullah, Soles, Josephine, Zhu, Long, Ren, Shenqiang
Published in ACS applied engineering materials (22.10.2024)
Published in ACS applied engineering materials (22.10.2024)
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Journal Article
Flexible Copper Nanowire Electronics for Wireless Dynamic Pressure Sensing
Khuje, Saurabh, Sheng, Aaron, Yu, Jian, Ren, Shenqiang
Published in ACS applied electronic materials (28.12.2021)
Published in ACS applied electronic materials (28.12.2021)
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Journal Article
Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials
Sheng, Aaron, Khuje, Saurabh, Li, Zheng, Yu, Jian, Ren, Shenqiang
Published in ACS applied electronic materials (22.11.2022)
Published in ACS applied electronic materials (22.11.2022)
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Journal Article
Lithiating magneto-ionics in a rechargeable battery
Hu, Yong, Gong, Weiyi, Wei, Sichen, Khuje, Saurabh, Huang, Yulong, Li, Zheng, Li, Yuguang C, Yao, Fei, Yan, Qimin, Ren, Shenqiang
Published in Proceedings of the National Academy of Sciences - PNAS (21.06.2022)
Published in Proceedings of the National Academy of Sciences - PNAS (21.06.2022)
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Journal Article
Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics
Sheng, Aaron, Khuje, Saurabh, Yu, Jian, Petit, Donald, Parker, Thomas, Zhuang, Cheng-Gang, Kester, Lanrik, Ren, Shenqiang
Published in Nano letters (28.10.2021)
Get full text
Published in Nano letters (28.10.2021)
Journal Article