UV‐Sinterable Silver Oxalate‐Based Molecular Inks and Their Application for In‐Mold Electronics
Liu, Xiangyang, Li, Derek, Fukutani, Hiroshi, Trudeau, Paul, Khoun, LoleÏ, Mozenson, Olga, Sampson, Kathleen L., Gallerneault, Mary, Paquet, Chantal, Lacelle, Thomas, Deore, Bhavana, Ferrand, Olivier, Ferrigno, Julie, Malenfant, Patrick R. L., Kell, Arnold J.
Published in Advanced electronic materials (01.09.2021)
Published in Advanced electronic materials (01.09.2021)
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Journal Article
Numerical and experimental investigation of resin flow, heat transfer and cure in a 3D compression resin transfer moulding process using fast curing resin
Sarojini Narayana, Sidharth, Khoun, Loleï, Trudeau, Paul, Milliken, Nicolas, Hubert, Pascal
Published in Advanced manufacturing. Polymer & composites science (31.12.2024)
Published in Advanced manufacturing. Polymer & composites science (31.12.2024)
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Investigation of the dimensional stability of carbon epoxy cylinders manufactured by resin transfer moulding
Khoun, Loleï, Hubert, Pascal
Published in Composites. Part A, Applied science and manufacturing (2010)
Published in Composites. Part A, Applied science and manufacturing (2010)
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Journal Article
Conference Proceeding
Influence of the reaction stoichiometry on the mechanical and thermal properties of SWCNT-modified epoxy composites
Ashrafi, Behnam, Martinez-Rubi, Yadienka, Khoun, Lolei, Yourdkhani, Mostafa, Kingston, Christopher T, Hubert, Pascal, Simard, Benoit, Johnston, Andrew
Published in Nanotechnology (05.07.2013)
Published in Nanotechnology (05.07.2013)
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Journal Article