Determination of the mechanical properties of austenitic stainless steel weldments by using stress strain microprobe
Khoshnaw, Fuad M., Hamakhan, Idrees A.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.06.2006)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.06.2006)
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Journal Article
Challenges in the manufacture of glass substrates for electrical and optical interconnect
Hutt, David A., Williams, Karen, Conway, Paul P., Khoshnaw, Fuad M., Cui, Xiaoyun, Bhatt, Deepa
Published in Circuit world (01.01.2007)
Published in Circuit world (01.01.2007)
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Journal Article
Corrosion behaviour of nitrided low alloy steel in chloride solution
Khoshnaw, Fuad M, Kheder, Abdulrazzaq I, Ali, Fidaa S.M
Published in Anti-corrosion methods and materials (29.05.2007)
Published in Anti-corrosion methods and materials (29.05.2007)
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Journal Article
Evaluation the moisture effects on the performance of electronic devices
Khoshnaw, Fuad M
Published in 2010 IEEE 14th Workshop on Signal Propagation on Interconnects (01.05.2010)
Published in 2010 IEEE 14th Workshop on Signal Propagation on Interconnects (01.05.2010)
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Conference Proceeding
First International Symposium on Urban Development: Koya as a case study
Published in First International Symposium on Urban Development
(2013)
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Book Chapter
Electrochemical migration of electronic components at sea environments - characterizations and solutions
Hussain, M.A., Khoshnaw, F.M.
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
Published in 2008 IEEE 9th VLSI Packaging Workshop of Japan (01.12.2008)
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Conference Proceeding
Glass Multilayer Lamination for PCB Manufacture using Pressure Assisted Low Temperature Bonding
Khoshnaw, F.M., Conway, L.P.P., Hutt, D.A., Williams, K.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Challenges in the Manufacture of Glass Substrates for Electrical and Optical Interconnect
Hutt, David A., Williams, Karen, Conway, Paul P., Khoshnaw, Fuad M., Cui, Xiaoyun, Bhatt, Deepa
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding